Abstract: A solder-bearing lead (10 or 10') is provided with solder-confining stops (20 and 22 or 20' and 22') to preclude detrimental flow of molten solder from a solder preform (12 or 12') on a contact finger (26 or 26') of the lead, along a stem (18 or 18') of the lead in a soldering operation. Accordingly, substantially all of the molten solder flows across the thickness of the contact (26 or 26') to a contact pad (14 or 14') and is confined on the contact pad to form a solder connection (44 or 44'). The solder-confining stops (20 and 22 or 20' and 22' ) are formed by oxidized portions of a base metal (phosphor bronze) from which portions of solder-wettable (tin) coatings (36 and 38 or 36' and 38') have been removed.