Patents by Inventor Carmichael Gugliotti

Carmichael Gugliotti has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Single step electrolytic method of filling through holes in printed circuit boards and other substrates
    Patent number: 11746433
    Abstract: A method of copper electroplating in the manufacture of printed circuit boards. The method is used for filling through-holes and micro-vias with copper. The method includes the steps of: (1) preparing an electronic substrate to receive copper electroplating thereon; (2) forming at least one of one or more through-holes and/or one or more micro-vias in the electronic substrate; and (3) electroplating copper in the at one or more through-holes and/or one or more micro-vias by contacting the electronic substrate with an acid copper electroplating solution. The acid copper plating solution comprises a source of copper ions; sulfuric acid; a source of chloride ions; a brightener; a wetter; and a leveler. The acid copper electroplating solution plates the one or more through-holes and/or the one or more micro-vias until metallization is complete.
    Type: Grant
    Filed: November 5, 2019
    Date of Patent: September 5, 2023
    Assignee: MACDERMID ENTHONE INC.
    Inventors: Donald Desalvo, Ron Blake, Carmichael Gugliotti, William J. Decesare, Richard Bellemare
  • Single Step Electrolytic Method of Filling Through Holes in Printed Circuit Boards and Other Substrates
    Publication number: 20210130970
    Abstract: A method of copper electroplating in the manufacture of printed circuit boards. The method is used for filling through-holes and micro-vias with copper. The method includes the steps of: (1) preparing an electronic substrate to receive copper electroplating thereon; (2) forming at least one of one or more through-holes and/or one or more micro-vias in the electronic substrate; and (3) electroplating copper in the at one or more through-holes and/or one or more micro-vias by contacting the electronic substrate with an acid copper electroplating solution. The acid copper plating solution comprises a source of copper ions; sulfuric acid; a source of chloride ions; a brightener; a wetter; and a leveler. The acid copper electroplating solution plates the one or more through-holes and/or the one or more micro-vias until metallization is complete.
    Type: Application
    Filed: November 5, 2019
    Publication date: May 6, 2021
    Inventors: Donald Desalvo, Ron Blake, Carmichael Gugliotti, William J. Decesare, Richard Bellemare