Patents by Inventor Carol A. Gamlen
Carol A. Gamlen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7607223Abstract: An electro-fluidic interconnection. The interconnection includes a body (200) formed of a ceramic material. The body (200) is provided with an aperture (206) having a profile suitable for receiving an interconnecting conduit (400). The interconnecting conduit (400) can be formed of the same type of ceramic material as the body (200). The conduit (400) is defined by an outer shell (403) with a hollow bore (402) for transporting a fluid. A mating portion (404) of the conduit has an exterior profile that matches the profile of the aperture. Moreover, the mating portion (404) of the conduit (400) can be compression fitted within the aperture (206). Conductive traces (406, 208) on the conduit and the body can be electrically connected to complete the electro-fluidic interconnection.Type: GrantFiled: August 7, 2007Date of Patent: October 27, 2009Assignee: Harris CorporationInventors: Mihael Pleskach, Paul Koeneman, Carol Gamlen, Steven R. Snyder
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Publication number: 20080141529Abstract: An electro-fluidic interconnection. The interconnection includes a body (200) formed of a ceramic material. The body (200) is provided with an aperture (206) having a profile suitable for receiving an interconnecting conduit (400). The interconnecting conduit (400) can be formed of the same type of ceramic material as the body (200). The conduit (400) is defined by an outer shell (403) with a hollow bore (402) for transporting a fluid. A mating portion (404) of the conduit has an exterior profile that matches the profile of the aperture. Moreover, the mating portion (404) of the conduit (400) can be compression fitted within the aperture (206). Conductive traces (406, 208) on the conduit and the body can be electrically connected to complete the electro-fluidic interconnection.Type: ApplicationFiled: August 7, 2007Publication date: June 19, 2008Applicant: HARRIS CORPORATIONInventors: Michael Pleskach, Paul Koeneman, Carol Gamlen, Steven R. Snyder
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Patent number: 7285000Abstract: An electro-fluidic interconnection. The interconnection includes a body (200) formed of a ceramic material. The body (200) is provided with an aperture (206) having a profile suitable for receiving an interconnecting conduit (400). The interconnecting conduit (400) can be formed of the same type of ceramic material as the body (200). The conduit (400) is defined by an outer shell (403) with a hollow bore (402) for transporting a fluid. A mating portion (404) of the conduit has an exterior profile that matches the profile of the aperture. Moreover, the mating portion (404) of the conduit (400) can be compression fitted within the aperture (206). Conductive traces (406, 208) on the conduit and the body can be electrically connected to complete the electro-fluidic interconnection.Type: GrantFiled: August 12, 2005Date of Patent: October 23, 2007Assignee: Harris CorporationInventors: Michael Pleskach, Paul Koeneman, Carol Gamlen, Steven R. Snyder
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Publication number: 20070053158Abstract: An electro-fluidic interconnection. The interconnection includes a body (200) formed of a ceramic material. The body (200) is provided with an aperture (206) having a profile suitable for receiving an interconnecting conduit (400). The interconnecting conduit (400) can be formed of the same type of ceramic material as the body (200). The conduit (400) is defined by an outer shell (403) with a hollow bore (402) for transporting a fluid. A mating portion (404) of the conduit has an exterior profile that matches the profile of the aperture. Moreover, the mating portion (404) of the conduit (400) can be compression fitted within the aperture (206). Conductive traces (406, 208) on the conduit and the body can be electrically connected to complete the electro-fluidic interconnection.Type: ApplicationFiled: August 12, 2005Publication date: March 8, 2007Applicant: HARRIS CORPORATIONInventors: Michael Pleskach, Paul Koeneman, Carol Gamlen, Steven Snyder
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Patent number: 7035591Abstract: A microelectromechanical structure and method is disclosed. A ceramic substrate preferably is formed from low temperature co-fired ceramic sheets. A low loss photodefinable dielectric planarizing layer is formed over one surface of the ceramic substrate. This layer can e a sacrificial layer or a subsequent sacrificial layer added. A photodefined conductor is printed over the low loss dielectric planarizing layer and formed with the sacrificial layer into a structural circuit component. In one aspect of the invention, a switch is formed with a biasing actuator and deflectable member formed over the biasing actuator and moveable into open and closed circuit positions.Type: GrantFiled: April 19, 2004Date of Patent: April 25, 2006Assignee: Harris CorporationInventors: Charles M. Newton, Raymond C. Rumpf, Carol Gamlen
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Patent number: 6987033Abstract: A method for making an electronic device includes positioning first and second members so that opposing surfaces thereof are in contact with one another, the first member comprising silicon and the second member comprising a low temperature co-fired ceramic (LTCC) material. The method further includes anodically bonding together the opposing surfaces of the first and second members to form a hermetic seal therebetween. The anodic bonding provides a secure and strong bond between the members without using adhesive. The method may further include forming at least one cooling structure in at least one of the first and second members. The least one cooling structure may comprise at least one first micro-fluidic cooling structure in the first member, and at least one second micro-fluidic cooling structure in the second member aligned with the at least one first micro-fluidic cooling structure.Type: GrantFiled: August 19, 2004Date of Patent: January 17, 2006Assignee: Harris CorporationInventors: Randy T. Pike, Charles M. Newton, Carol Gamlen, Raymond C. Rumpf, Betty O'Dowd
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Publication number: 20050068726Abstract: An electro-fluidic device may include a substrate having at least one substrate fluid passageway therein, and at least one substrate electrical conductor carried by the substrate. Moreover, an external interface may be spaced from the substrate and include at least one interface electrical conductor. The electro-fluidic device may also include at least one electro-fluidic interconnect extending between the substrate and the external interface. More particularly, the at least one electro-fluidic interconnect may include an interconnect body having at least one interconnect fluid passageway extending therethrough and connected to the at least one substrate fluid passageway, and at least one interconnect electrical conductor carried by the interconnect body. The at least one interconnect electrical conductor may connect the at least one substrate electrical conductor and the at least one interface electrical connector.Type: ApplicationFiled: September 25, 2003Publication date: March 31, 2005Applicant: Harris CorporationInventors: Michael Pleskach, Paul Koeneman, Brian Smith, Charles Newton, Carol Gamlen
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Publication number: 20050019986Abstract: A method for making an electronic device includes positioning first and second members so that opposing surfaces thereof are in contact with one another, the first member comprising silicon and the second member comprising a low temperature co-fired ceramic (LTCC) material. The method further includes anodically bonding together the opposing surfaces of the first and second members to form a hermetic seal therebetween. The anodic bonding provides a secure and strong bond between the members without using adhesive. The method may further include forming at least one cooling structure in at least one of the first and second members. The least one cooling structure may comprise at least one first micro-fluidic cooling structure in the first member, and at least one second micro-fluidic cooling structure in the second member aligned with the at least one first micro-fluidic cooling structure.Type: ApplicationFiled: August 19, 2004Publication date: January 27, 2005Inventors: Randy Pike, Charles Newton, Carol Gamlen, Raymond Rumpf, Betty O'Dowd
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Patent number: 6809424Abstract: A method for making an electronic device includes positioning first and second members so that opposing surfaces thereof are in contact with one another, the first member comprising silicon and the second member comprising a low temperature co-fired ceramic (LTCC) material. The method further includes anodically bonding together the opposing surfaces of the first and second members to form a hermetic seal therebetween. The anodic bonding provides a secure and strong bond between the members without using adhesive. The method may further include forming at least one cooling structure in at least one of the first and second members. The least one cooling structure may comprise at least one first micro-fluidic cooling structure in the first member, and at least one second micro-fluidic cooling structure in the second member aligned with the at least one first micro-fluidic cooling structure.Type: GrantFiled: December 19, 2000Date of Patent: October 26, 2004Assignee: Harris CorporationInventors: Randy T. Pike, Charles M. Newton, Carol Gamlen, Raymond C. Rumpf, Betty O'Dowd
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Publication number: 20040198231Abstract: A microelectromechanical structure and method is disclosed. A ceramic substrate preferably is formed from low temperature co-fired ceramic sheets. A low loss photodefinable dielectric planarizing layer is formed over one surface of the ceramic substrate. This layer can e a sacrificial layer or a subsequent sacrificial layer added. A photodefined conductor is printed over the low loss dielectric planarizing layer and formed with the sacrificial layer into a structural circuit component. In one aspect of the invention, a switch is formed with a biasing actuator and deflectable member formed over the biasing actuator and moveable into open and closed circuit positions.Type: ApplicationFiled: April 19, 2004Publication date: October 7, 2004Applicant: HARRIS CORPORATIONInventors: Charles M. Newton, Raymond C. Rumpf, Carol Gamlen
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Patent number: 6738600Abstract: A microelectromechanical structure and method is disclosed. A ceramic substrate preferably is formed from low temperature co-fired ceramic sheets. A low loss photodefinable dielectric planarizing layer is formed over one surface of the ceramic substrate. This layer can be a sacrificial layer or a subsequent sacrificial layer added. A photodefined conductor is printed over the low loss dielectric planarizing layer and formed with the sacrificial layer into a structural circuit component. In one aspect of the invention, a switch is formed with a biasing actuator and deflectable member formed over the biasing actuator and moveable into open and closed circuit positions.Type: GrantFiled: August 4, 2000Date of Patent: May 18, 2004Assignee: Harris CorporationInventors: Charles M. Newton, Raymond C. Rumpf, Carol Gamlen
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Publication number: 20020130408Abstract: A method for making an electronic device includes positioning first and second members so that opposing surfaces thereof are in contact with one another, the first member comprising silicon and the second member comprising a low temperature co-fired ceramic (LTCC) material. The method further includes anodically bonding together the opposing surfaces of the first and second members to form a hermetic seal therebetween. The anodic bonding provides a secure and strong bond between the members without using adhesive. The method may further include forming at least one cooling structure in at least one of the first and second members. The least one cooling structure may comprise at least one first micro-fluidic cooling structure in the first member, and at least one second micro-fluidic cooling structure in the second member aligned with the at least one first micro-fluidic cooling structure.Type: ApplicationFiled: March 8, 2001Publication date: September 19, 2002Applicant: Harris CorporationInventors: Randy T. Pike, Charles M. Newton, Carol Gamlen, Raymond C. Rumpf, Betty O'Dowd
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Patent number: 6437981Abstract: A thermally enhanced microcircuit package includes a microcircuit package having a microcircuit device cavity that receives a microcircuit device. A microelectromechanical (MEMS) cooling module is operatively connected to the microcircuit package and forms a capillary pumped loop cooling circuit having an evaporator, condenser and interconnecting cooling fluid channels for passing vapor and fluid between the evaporator and condenser and evaporating and condensing the cooling fluid. The evaporator is operatively associated with the microcircuit device for cooling the device when in use.Type: GrantFiled: November 30, 2000Date of Patent: August 20, 2002Assignee: Harris CorporationInventors: Charles M. Newton, Carol A. Gamlen, Raymond C. Rumpf, Jr.
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Publication number: 20020101719Abstract: A thermally enhanced microcircuit package includes a microcircuit package having a microcircuit device cavity that receives a microcircuit device. A microelectromechanical (MEMS) cooling module is operatively connected to the microcircuit package and forms a capillary pumped loop cooling circuit having an evaporator, condenser and interconnecting cooling fluid channels for passing vapor and fluid between the evaporator and condenser and evaporating and condensing the cooling fluid. The evaporator is operatively associated with the microcircuit device for cooling the device when in use.Type: ApplicationFiled: November 30, 2000Publication date: August 1, 2002Applicant: Harris CorporationInventors: Charles M. Newton, Carol A. Gamlen, Raymond C. Rumpf