Abstract: Multi-layer cover tape constructions include a polymeric substrate with a low adhesion backsize coating layer on one surface and an adhesive layer on the other surface, with a conductive film construction adhered to a portion of the adhesive layer such that portions of the adhesive remain exposed. The conductive film construction includes a polymeric substrate with an exposed layer of abrasion-resistant, electrically conductive nano-scale graphite coated by buff coating. Other multi-layer cover tape constructions include a polymeric substrate with a low adhesion backsize coating layer on one surface, and an exposed layer of abrasion-resistant, electrically conductive nano-scale graphite particles coated on the other surface. Stripes of adhesive are present on a portion of the electrically conductive coating such that portions of the electrically conductive coating remain exposed between the adhesive stripes.

Abstract: A cover tape for an electronic component carrier including a polyester substrate, a layer of an electrically conductive coating comprising a dispersion of a conductive polymer selected from the group consisting of polythiophenes and polyanilines, said polymer having a conjugated polymer backbone and polymeric polyanion compounds, and a binder coated on at least a portion of at least one major surface of the substrate, and a layer containing a polymeric pressure-sensitive adhesive composition, where the tape having a degree of clarity of from about 80% to about 99%, and a surface resistance of from about 1×104 to about 1×1012 Ohm.