Abstract: Systems and methods are provided for transferring a remote frequency identification (RFID) inlay from a first substrate to a second substrate. An RFID inlay is secured to a first substrate with a first adhesive. The RFID inlay is brought into the vicinity of a second substrate and secured to the second substrate with a second adhesive. The RFID inlay is then dissociated from the first substrate. The RFID inlay may be dissociated from the first substrate by softening the first adhesive, such as by the application of heat or the application of a softening substance. Alternatively, the RFID inlay may be dissociated from the first substrate without softening the first adhesive, but rather by differential release, whereby a release force is applied between the two substrates, with the release force being greater than the release strength of the first adhesive, but less than the release strength of the second adhesive.

Abstract: An RFID device includes an antenna that is formed so as to control the optical properties of the RFID device, which may include minimizing the amount of light that will be transmitted through the RFID device or allowing for the passage of a predetermined amount of light therethrough. The RFID device includes a conductive material associated with a substrate. The conductive material includes an antenna and a periphery. An RFID chip is electrically coupled to the antenna, but not to the periphery. The antenna may be defined by a cutting or etching or printing process. A gap between the antenna and the periphery may be on the order of approximately 25 ?m-200 ?m (if the transmission of light through the RFID device is to be minimized) or greater in at least one section (if the passage of a predetermined amount of light through the RFID device would be desirable).