Abstract: Described embodiments provide for a semiconductor device comprising a core and one or more input/output (I/O) buffers surrounding the core. The I/O buffers are adapted to transfer signals associated with core circuitry of the core. The I/O buffers comprise I/O cells having a first orientation and I/O cells having a second orientation. Each I/O cell has a corresponding translator having low voltage transistors in a corresponding footprint. The low voltage transistors in the first orientation I/O cells have the first orientation, and the low voltage transistors in the second orientation I/O cells have the first orientation. The footprints of the first orientation I/O cells and the second orientation I/O cells are compatible with one another.

Abstract: Described herein are embodiments directed to electronically managing infections in healthcare facilities. A treating infection preventionist (“IP”) uses a remote computer to access patients assigned to the IP. A server analyzes healthcare data associated with patients and groups the patients into different infection control categories (“IC categories”) for treatment or further monitoring. The IP can view assigned patients by their IC categories, receive alerts for potentially dangerous conditions in patients, and access real-time patient records from a remote computer.

Abstract: A buffer circuit is selectively operative in one of at least a first mode and a second mode as a function of a first control signal supplied to the buffer circuit. The buffer circuit includes interface circuitry operative to receive at least second and third control signals referenced to a first voltage level, and to generate an output signal referenced to a second voltage level, the second voltage level being greater than the first voltage level. The output signal is a function of the second control signal in the first mode and is a function of the third control signal in the second mode. The buffer circuit further includes at least first and second circuit portions coupled to the interface circuitry, each of the first and second circuit portions including at least one control input operative to receive the output signal generated by the interface circuitry.

Abstract: A buffer circuit is selectively operative in one of at least a first mode and a second mode as a function of a first control signal supplied to the buffer circuit. The buffer circuit includes interface circuitry operative to receive at least second and third control signals referenced to a first voltage level, and to generate an output signal referenced to a second voltage level, the second voltage level being greater than the first voltage level. The output signal is a function of the second control signal in the first mode and is a function of the third control signal in the second mode. The buffer circuit further includes at least first and second circuit portions coupled to the interface circuitry, each of the first and second circuit portions including at least one control input operative to receive the output signal generated by the interface circuitry.

Abstract: A buffer design for an integrated circuit that has adjustable slew rate control, yet requires significantly less space to fabricate than does a conventional buffer with slew rate control. A new slew rate control circuit design is added to a Complementary Metal Oxide Semiconductor CMOS buffer to implement slew rate control in the buffer (e.g., selection between a high slew rate and a low slew rate). The new slew rate control circuit requires significantly less space to fabricate, and when applied to each buffer in an given integrated circuit, e.g., input/output buffers that may be placed along the periphery of the integrated circuit, the savings can be extraordinary.

Abstract: Using at best a 2.5V nominal power supply, 3.3V technology can be used to implement a 5V tolerant open drain output buffer. High voltage and/or current tolerance is achieved with only the 2.5V power supply. A p-channel FET transistor is connected between a power supply and a node, which in turn is connected to a node between two series output FET transistors. The first transistor is connected between the PAD and node, and the second transistor is connected between the node and ground. The gate of the second transistor is driven from another node formed between a series string of a p-channel FET transistor and an n-channel FET transistor. The other side of the first transistor is connected to the power supply, and the other side of the second transistor is connected to ground. The gates of the transistors the inverter are tied together and driven by an applied signal.

Abstract: An integrated circuit die comprises an internal signal pad arranged at a location away from a periphery of the die, a peripheral signal pad arranged proximate the periphery of the die, and a switch coupled between the internal signal pad and the peripheral signal pad. The switch is configurable in at least a first state in which the internal signal pad is not operatively connected to the peripheral signal pad, and a second state in which the internal signal pad is operatively connected to the peripheral signal pad, responsive to a control signal having one of respective first and second signal characteristics. The switch is configured in the first state during normal operation of the integrated circuit die, and is configured in the second state to permit test access to the internal signal pad via the peripheral signal pad.

Abstract: CMOS technology is used to create a controlled output impedance output buffer circuit. An output buffer driver uses buffer circuits having impedance elements with linear characteristics. A control circuit uses a known impedance load to control the impedance of the buffer circuits. The control circuit monitors a known current flowing through the known impedance load to determine whether the output buffer circuit's output impedance needs to be adjusted to match a transmission line's impedance. Adjustments occur when the control circuit generates control signals to turn on or off various buffer circuits (and their impedance elements) contained within the output driver. In doing so, the output buffer circuit ensures that its output impedance will match the impedance of a transmission line over the entire range of output voltages regardless of the variations caused by the manufacturing process, operation temperature and power supply voltage.