Abstract: A temporary package used to test and burn-in a bare die that will fit in a board mounted socket. The package comprises a base having contacts to engage the die and provide contact to the outer periphery, a lid for pressing the die into electrical contact and a protective cover to restrict the die from damage due to external pressures to the sides or top of the package. The die, lid and protective cover can be assembled onto the base and removed by automated equipment.

Abstract: A top-load test and burn-in socket, for use with IC devices having a plurality of contact terminals located in a predetermined pattern on a surface of said device, adapted for automation has a base supporting a plurality of contacts, a flexible film having a conductive wiring pattern formed thereon, and an elastomeric support having a size and shape to support said first set of conductive pads with the flexible film being folded about said elastomeric support. A movable cover and a pair of cams afford the retraction of springs which press the IC device against the film along opposite ends.