Patents by Inventor Carol Myers

Carol Myers has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20030044448
    Abstract: A preservative for high-moisture organic materials including one or more organic acids combined with either or both a surfactant and an antioxidant. Preferably, the organic acids include propionic acid, acetic acid, benzoic acid, or sorbic acid; the surfactants include propylene glycol, lecithin, lysolecithin, and mono- and diglycerides; the antioxidants include synthetic and natural antioxidants, specifically, TBHQ, citric acid, BHT, BHA, tocopherols, and extracts of rosemary.
    Type: Application
    Filed: January 17, 2002
    Publication date: March 6, 2003
    Inventors: Carol Myers, Heath Kellogg
  • Patent number: 5727310
    Abstract: A heat resistant multilayer circuit board used in the transportation environment in cars, boats, planes, etc, having two or more conductive layers, with at least two conductive layers electrically and mechanically connected by an interconnecting adhesive layer, at least one of the conductive layers being affixed to a heat resistant substrate. The interconnecting adhesive layer comprises a conductive adhesive material having a plurality of deformable, heat fusible metallic particles dispersed substantially throughout a non-conductive adhesive. The fabricated multilayer circuit boards have interconnections which are reliable, heat resistant, and capable of withstanding thermal cycling and typical circuit board finishing and assembly processes.
    Type: Grant
    Filed: June 11, 1996
    Date of Patent: March 17, 1998
    Assignee: Sheldahl, Inc.
    Inventors: Keith L. Casson, Carol Myers, Kenneth B. Gilleo, Deanna Suilmann, Edward Mahagnoul, Marion Tibesar
  • Patent number: 5688584
    Abstract: A multilayer circuit board having three or more conductive layers, with at least two conductive layers electrically and mechanically connected by an interconnecting adhesive layer, is disclosed. The interconnecting adhesive layer comprises a conductive adhesive material having a plurality of deformable, heat fusible metallic particles dispersed substantially throughout a non-conductive adhesive. The fabricated multilayer circuit boards have interconnections which are reliable, heat resistant, and capable of withstanding thermal cycling and typical circuit board finishing and assembly processes.
    Type: Grant
    Filed: September 27, 1995
    Date of Patent: November 18, 1997
    Assignee: Sheldahl, Inc.
    Inventors: Keith L. Casson, Carol Myers, Kenneth B. Gilleo, Deanna Suilmann, Edward Mahagnoul, Marion Tibesar
  • Patent number: 5502889
    Abstract: A multilayer circuit board having three or more conductive layers, with at least two conductive layers electrically and mechanically connected by an interconnecting adhesive layer, is disclosed. The interconnecting adhesive layer comprises a conductive adhesive material having a plurality of deformable, heat fusible metallic particles dispersed substantially throughout a non-conductive adhesive. The fabricated multilayer circuit boards have interconnections which are reliable, heat resistant, and capable of withstanding thermal cycling and typical circuit board finishing and assembly processes.
    Type: Grant
    Filed: January 8, 1993
    Date of Patent: April 2, 1996
    Assignee: Sheldahl, Inc.
    Inventors: Keith L. Casson, Carol Myers, Kenneth B. Gilleo, Deanna Suilmann, Edward Mahagnoul, Marion Tibesar