Patents by Inventor Carol Radens

Carol Radens has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Interconnect structures with encasing cap and methods of making thereof
    Patent number: 7488677
    Abstract: A method of making an interconnect that includes providing an interconnect structure in a dielectric material, recessing the dielectric material such that a portion of the interconnect structure extends above an upper surface of the dielectric; and depositing an encasing cap over the extended portion of the interconnect structure.
    Type: Grant
    Filed: August 14, 2006
    Date of Patent: February 10, 2009
    Assignee: International Business Machines Corporation
    Inventors: Kwong Hon Wong, Louis C. Hsu, Timothy J. Dalton, Carol Radens, Chih-Chao Yang, Lawrence A. Clevenger, Theodorus E. Standaert