Abstract: Structure for mounting electronic devices thereon. The structure is fabricated from a plurality of substrates each having a thermally and/or electrically conductive core surrounded by a dielectric material. The substrates can be adherently placed together with the electrically conductive cores providing ground and power planes or the substrates can be mounted together with connectors electrically interconnecting adjacent substrates and spacing the adjacent substrates apart providing a space through which a fluid can flow to extract heat generated by the electronic devices mounted thereon. The conductive cores provide both power and ground planes to the structure and a means for thermally dissipating the generated heat.