Patents by Inventor Caroline E. Reilly

Caroline E. Reilly has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • WAFER BONDING FOR EMBEDDING ACTIVE REGIONS WITH RELAXED NANOFEATURES
    Publication number: 20220102580
    Abstract: A method for fabricating a device, as well as the device itself, which includes growing a bonding layer on a first wafer or substrate, wherein the bonding layer includes at least partially relaxed features; and then bonding a second wafer or substrate to the features in on the first wafer or substrate, to cap and contact the features with separately grown material.
    Type: Application
    Filed: January 16, 2020
    Publication date: March 31, 2022
    Applicant: The Regents of the University of California
    Inventors: Caroline E. Reilly, Umesh K. Mishra, Stacia Keller, Steven P. DenBaars