Patents by Inventor Caroline Kistner

Caroline Kistner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for producing an optoelectronic semiconductor device, and optoelectronic semiconductor device
    Patent number: 9490397
    Abstract: A method for producing an optoelectronic thin-film chip semiconductor device is specified. A conductor structure is applied on a carrier and a multiplicity of optoelectronic semiconductor chips are arranged between the conductor structures. Each of the optoelectronic semiconductor chips includes a layer at a top side. Furthermore, electrical connections between semiconductor chip and the conductor structure are established, for instance using a bonding wire. The semiconductor chips and the conductor structure are surrounded with a molded body. The molded body does not project beyond the optoelectronic semiconductor chips at the top side thereof facing away from the carrier. Moreover, the carrier is removed and the semiconductor chips surrounded by molding are singulated.
    Type: Grant
    Filed: December 17, 2013
    Date of Patent: November 8, 2016
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Stephan Preuβ, Michael Zitzlsperger, Caroline Kistner
  • Method for Producing an Optoelectronic Semiconductor Device, and Optoelectronic Semiconductor Device
    Publication number: 20150333232
    Abstract: A method for producing an optoelectronic thin-film chip semiconductor device is specified. A conductor structure is applied on a carrier and a multiplicity of optoelectronic semiconductor chips are arranged between the conductor structures. Each of the optoelectronic semiconductor chips includes a layer at a top side. Furthermore, electrical connections between semiconductor chip and the conductor structure are established, for instance using a bonding wire. The semiconductor chips and the conductor structure are surrounded with a molded body. The molded body does not project beyond the optoelectronic semiconductor chips at the top side thereof facing away from the carrier. Moreover, the carrier is removed and the semiconductor chips surrounded by molding are singulated.
    Type: Application
    Filed: December 17, 2013
    Publication date: November 19, 2015
    Inventors: Stephan Preuß, Michael Zitzlsperger, Caroline Kistner