Abstract: A device (10) supports a substrate during the manufacture of semiconductor components. The device includes a substantially flat plate with an upper surface (11) on which the substrate can be positioned. In some embodiments, the device (10) is of inexpensive and simple construction and allows for the passage of a process gas in the direction of the substrate under certain manufacturing conditions, for example for supplying a protective gas to the substrate or having the substrate rest on an air cushion. The upper surface (11) of the plate is at least partially porous (14). Thus, costly and extremely precise machining of the device (10), as usually required in the current state of the art, is unnecessary, thereby making it possible to manufacture the device (10) at much lower cost.

Abstract: The invention to a device (10) for supporting a substrate during the manufacture of semiconductor components, comprising a substantially flat plate with an upper surface (11) on which the substrate can be positioned. The invention also relates to a method for manufacturing such a device (10). The object of the invention is to provide a device (10) according to the preamble, which is of inexpensive and simple construction but which also allows the passage of a process gas in the direction of the substrate under certain manufacturing conditions, for example for supplying a protective gas to the substrate or having the substrate rest on an air cushion. According to the invention, the upper surface (11) of the plate is at least partially porous (14). Thus, costly and extremely precise machining of the device (10), as usually required in the current state of the art, is unnecessary, thereby making it possible to manufacture the device (10) at much lower cost.