Abstract: A curable epoxy composition includes an epoxy resin, a hydroxyl-terminated polyphenylene ether, and an oligomeric aromatic organophosphate ester flame retardant, wherein at least 60% of the oligomeric aromatic organophosphate ester flame retardant includes at least two hydroxy terminal groups, and the amount of each component of the composition is specified herein. The composition can be particularly useful in circuit material prepregs, thermoset epoxy compositions, and various articles. A method for the manufacture of a thermoset composition is also described.

Abstract: A composite comprises a reinforcing fabric and an at least partially cured composition at least partially coating the reinforcing fabric, wherein the reinforcing fabric comprises first fibers wrapped with, woven with, or wrapped and woven with polyimide fibers, and the at least partially cured composition comprises the product of 30 to 70 weight percent of a poly(phenylene ether) having a number average molecular weight of 600 to 2000 AMU, 30 to 70 weight percent of a curable component, and a curing agent, wherein weight percent is based on the combined weight of poly(phenylene ether) and the curable component.

Abstract: A method of preparing a capped poly(arylene ether) is described. By controlling the order of addition and rates of addition of reactants, solvent, and catalyst, problems associated with known methods are avoided. The method is particularly suitable for large-scale preparations of a capped poly(arylene ether).