Abstract: A solar cell module and a method for operating a solar cell module. The solar cell module includes a plurality of strings which are each formed from a plurality of solar cells connected to one another in a series circuit, wherein each string is connected to a bypass circuit assigned thereto. The solar cell module is also characterized in that the bypass circuit has a switching element and is configured to reduce an electrical current inside the string by switching the switching element when a return current occurs within the associated string.

Abstract: A solar cell module and a method for operating a solar cell module. The solar cell module includes a plurality of strings which are each formed from a plurality of solar cells connected to one another in a series circuit, wherein each string is connected to a bypass circuit assigned thereto. The solar cell module is also characterized in that the bypass circuit has a switching element and is configured to reduce an electrical current inside the string by switching the switching element when a return current occurs within the associated string.

Abstract: A method for joining a fastening element on to a surface portion of a component, the fastening element having an adhesion face, on to which there is applied an adhesive that is thermally meltable and thermally settable, comprising the steps of: pre-heating the adhesive to a first temperature (T1), in order to activate the adhesive; pre-heating the surface portion to a second temperature (T2); and placing the adhesion face on to the surface portion; the adhesive undergoing main heating, to a third temperature (T3), after the adhesion face has been placed on to the surface portion, in order to set the adhesive and thereby permanently fasten the fastening element to the component.

Abstract: A method for joining a fastening element on to a surface portion of a component, the fastening element having an adhesion face, on to which there is applied an adhesive that is thermally meltable and thermally settable, comprising the steps of: pre-heating the adhesive to a first temperature (T1), in order to activate the adhesive; pre-heating the surface portion to a second temperature (T2); and placing the adhesion face on to the surface portion; the adhesive undergoing main heating, to a third temperature (T3), after the adhesion face has been placed on to the surface portion, in order to set the adhesive and thereby permanently fasten the fastening element to the component.

Abstract: Semiconductor components such as transistor components, for example, which exist on high Al-containing active layers or layers supplying charge carriers, having a new layer construction providing increased charge carrier mobility.