Abstract: When forming layer stacks in the presence of solder material, uncontrolled flow of the solder material at the interface of two different layers of the layer stack may significantly be mitigated by providing an area of increased pressure in the material of the overlaying foil layer. For example, the area of increased pressure may be generated during the lamination process by providing a pressure inducing structure, for instance on the underlying foil layer, which laterally surrounds the solder material and therefore, in combination with the material of the overlying foil layer, reliably confines the solder material.

Abstract: The present disclosure provides in various aspects for a method of forming a prelam body of a smart card and a prelam body of a smart card. In some illustrative embodiments, a prelam body of a smart card comprises at least one contact terminal patch, which comprises a patch base layer and a plurality of conductive pads provided on a surface of the patch base layer, wherein the plurality of conductive pads is arranged on the patch base layer in accordance with a predefined interconnection design, and a prelam sheet with a plurality of openings, each opening accommodating a dedicated one of the conductive pads, wherein the at least one contact terminal patch is mounted to the prelam sheet.

Abstract: When forming smartcards or pre-forms thereof additional functionality may be implemented by, for instance, incorporating components, such as a display device, and the like, by preparing pre-packages separately from the rest of the pre-forms and subsequently inserting the pre-packages into the pre-forms, thereby achieving superior process robustness and production yield.

Abstract: Biometric sensor module for a chip card, and method for producing such a module. Method for producing a biometric sensor module for a chip card, including steps of providing a dielectric carrier including a front face and a back face, both forming main faces of the carrier, attaching a biometric sensor for detecting fingerprints to the back face, a detection area covered by the sensor on the back face being placed opposite a detection area on the front face, producing electrically conductive connection pads on the back face of the carrier which are electrically connected to the biometric sensor, at least one connection pad includes a region that is wettable with a solder material, extending over an area of between 0.2 and 5 square millimetres.

Abstract: When forming layer stacks in the presence of solder material, uncontrolled flow of the solder material at the interface of two different layers of the layer stack may significantly be mitigated by providing an area of increased pressure in the material of the overlaying foil layer. For example, the area of increased pressure may be generated during the lamination process by providing a pressure inducing structure, for instance on the underlying foil layer, which laterally surrounds the solder material and therefore, in combination with the material of the overlying foil layer, reliably confines the solder material.

Abstract: The invention relates to a chip card including a card body made of plastic material and having several functions possibly managed by a controller and energy supplied by an electrical energy power supply device, such as a battery. Various components, like a chip for bank transactions, a sensor of biometric characteristics, a display device, etc. may be incorporated in modules placed in cavities formed in constituent layers of the body of the card. The invention relates also to a method for fabricating such a chip card.

Abstract: A transponder apparatus for a transponder unit has a UHF and HF transponder The UHF transponder has a transponder support, a UHF antenna and a UHF chip. The HF transponder has an HF antenna and an HF chip. The UHF antenna is at the transponder support and is made up of conducting UHF antenna structures in transponder support planes which are spatially separated from one another. The transponder apparatus includes an electrically-insulating attachment layer connecting the UHF transponder to the HF antenna. The transponder apparatus includes an electrically-insulating spacer element connected to the HF transponder and which spatially separates the UHF transponder and the HF transponder relative to a body. The UHF transponder is disposed on the HF antenna. A conducting HF antenna structure of the HF antenna extends beyond a covering surface of the UHF transponder and the HF antenna structure.

Abstract: The invention relates to a contact bump connection (24) and to a method for producing a contact bump connection between an electronic component being provided with at least one terminal face (11) and a contact substrate (26) being contacted with the component and having at least one second terminal face (25), wherein the first terminal face is provided with a contact bump (10), which has a raised edge (15) and has at least one displacement pin (16) in a displacement compartment (18) being surrounded by the raised edge and being open towards a head end of the contact bump, and wherein, in a contact region (31) with the first terminal face, the second terminal face has a contact bead (30), which is formed by displacement of a contact material (29) of the second terminal face into the displacement compartment and which surrounds the displacement pin, said contact bead having a bead crown (33) which is oriented to a bottom (17) of the displacement compartment and is raised relative to a level contact surface (32)

Abstract: The invention relates to a method for producing chips (13) by dividing a wafer along dividing lines (11, 12) defining dimensions of the chip, wherein a focus (18) of a preferably pulsed laser radiation (16) is moved along the dividing lines on a first and at least a second path (25, 26) within the wafer body, wherein the laser radiation is applied to the wafer from a rear side (17) of the wafer, and the power density for producing the defects (28) on the first path (25) is lower than the power density for producing the defects (29) on the second path (26), and/or the number of defects on the first path is smaller than the number of defects on the second path.

Abstract: The invention relates to a transponder apparatus (10) for a transponder unit which can be worn on a human or animal body, such as a collar, band or the like, comprising a UHF transponder and an HF transponder (12), wherein the UHF transponder is made up of a transponder support (11), a UHF antenna and a UHF chip, wherein the HF transponder is made up of an HF antenna (16) and an HF chip (15), wherein the UHF antenna is disposed at the transponder support and is made up of conducting UHF antenna structures in transponder support planes which are spatially separated from one another, wherein the transponder apparatus comprises an electrically-insulating attachment layer (13) which connects the UHF transponder to the HF antenna, wherein the transponder apparatus comprises an electrically-insulating spacer element (14) which is connected to the HF transponder and which spatially separates the UHF transponder and the HF transponder relative to a body (20), wherein the UHF transponder is disposed on the HF antenna,

Abstract: The invention relates to a method for producing chips (13) by dividing a wafer along dividing lines (11, 12) defining dimensions of the chip, wherein a focus (18) of a preferably pulsed laser radiation (16) is moved along the dividing lines on a first and at least a second path (25, 26) within the wafer body, wherein the laser radiation is applied to the wafer from a rear side (17) of the wafer, and the power density for producing the defects (28) on the first path (25) is lower than the power density for producing the defects (29) on the second path (26), and/or the number of defects on the first path is smaller than the number of defects on the second path.

Abstract: Contact bumps between a contact pad and a substrate can include a rough surface that can mate with the material of the substrate. The rough surface can enhance the bonding strength of the contacts, for example, against shear and tension forces, especially for flexible systems such as smart cards.

Abstract: The invention relates to a method for producing chips (13) by dividing a wafer along dividing lines (11, 12) defining dimensions of the chip, wherein a focus (18) of a preferably pulsed laser radiation (16) is moved along the dividing lines on a first and at least a second path (25, 26) within the wafer body, wherein the laser radiation is applied to the wafer from a rear side (17) of the wafer, and the power density for producing the defects (28) on the first path (25) is lower than the power density for producing the defects (29) on the second path (26), and/or the number of defects on the first path is smaller than the number of defects on the second path.

Abstract: Contact bumps between a contact pad and a substrate can include recesses and protrusions that can mate with the material of the substrate. The irregular mating surfaces between the contact bumps and the contact pads can enhance the bonding strength of the contacts, for example, against shear and tension forces, especially for flexible systems such as smart cards.

Abstract: The invention relates to a transponder layer (30), in particular for producing a laminate structure, for example being embodied as a chip card, having an antenna substrate (31), which, on an antenna side (38), is equipped with an antenna (33) formed from a wire conductor (32) as well as with a chip (41), and which, on the antenna side, has terminal conductors for connecting the chip to the wire conductor of the antenna, in such a manner that the chip is arranged adjacently to terminal ends (34, 35) of the wire conductor, and in such a manner that both the terminal ends of the wire conductor and chip terminals (39, 40), which are arranged on a contact side of a semiconductor body of the chip, said contact side facing towards the antenna substrate, are contacted with the terminal conductors.

Abstract: The invention relates to a contact bump connection (24) and to a method for producing a contact bump connection between an electronic component being provided with at least one terminal face (11) and a contact substrate (26) being contacted with the component and having at least one second terminal face (25), wherein the first terminal face is provided with a contact bump (10), which has a raised edge (15) and has at least one displacement pin (16) in a displacement compartment (18) being surrounded by the raised edge and being open towards a head end of the contact bump, and wherein, in a contact region (31) with the first terminal face, the second terminal face has a contact bead (30), which is formed by displacement of a contact material (29) of the second terminal face into the displacement compartment and which surrounds the displacement pin, said contact bead having a bead crown (33) which is oriented to a bottom (17) of the displacement compartment and is raised relative to a level contact surface (32)

Abstract: Contact bumps between a contact pad and a substrate can include recesses and protrusions that can mate with the material of the substrate. The irregular mating surfaces between the contact bumps and the contact pads can enhance the bonding strength of the contacts, for example, against shear and tension forces, especially for flexible systems such as smart cards.

Abstract: A magnetic-guiding laminate is used to improve wireless communication between a transmitter and a receptor disposed on a substrate, regardless of the substrate materials. The laminate can comprise one or more layers of magnetic or non-magnetic material with different magnetic property. For example, the laminate can comprise a paramagnetic layer disposed on a diamagnetic layer, where the paramagnetic layer attracts the magnetic field toward the RFID antenna, and the diamagnetic layer prevents the magnetic field from dispersing in the substrate. Alternatively, the laminate can comprise multiple paramagnetic layers, wherein at least two layers have different magnetic properties, such as different permeability values.

Abstract: A magnetic-guiding laminate is used to improve wireless communication between a transmitter and a receptor disposed on a substrate, regardless of the substrate materials. The laminate can comprise one or more layers of magnetic or non-magnetic material with different magnetic property. For example, the laminate can comprise a paramagnetic layer disposed on a diamagnetic layer, where the paramagnetic layer attracts the magnetic field toward the RFID antenna, and the diamagnetic layer prevents the magnetic field from dispersing in the substrate. Alternatively, the laminate can comprise multiple paramagnetic layers, wherein at least two layers have different magnetic properties, such as different permeability values.