Abstract: An electronic device includes a substrate including a core layer; a cavity formed in the core layer, wherein the cavity includes sidewalls plated with a conductive material; a prefabricated passive electronic component disposed in the cavity; and a cavity sidewall connection providing electrical continuity from the plated cavity sidewalls to a first surface of the substrate and to a second surface of the substrate.

Abstract: A substrate for an electronic device may include a core. The substrate may include a passive electronic component. For instance, the substrate may include a continuous layer of molding material encapsulating the passive electronic component within the core. One or more through vias may extend between a first surface of the core and a second surface of the core. The substrate may include one or more layers coupled with the core. One or more component terminals may facilitate electrical communication between the passive electronic component and one or more of the first layer or the second layer.

Abstract: Transmission pathways in substrates, and associated methods are shown. Example transmission pathways include a semiconductor substrate with a core, a dielectric layer fixed on the core, at least one first electrical transmission pathway extending through at least one of the dielectric layer and the core. The first pathway includes a magnetic material disposed within the at least the core of the at least one first electrical transmission pathway, at least one second electrical transmission pathway extending through the magnetic material, a nickel layer disposed on inner circumferential surface of the magnetic material at least within the second electrical transmission pathway, a copper layer disposed on at least the nickel layer within the second electrical transmission pathway. The dielectric spacer or the nickel layer separates the copper layer from the magnetic material.

Abstract: Tissue-engineered electronic peripheral nerve interface (TEENI) devices, methods of using TEENI devices, and systems using TEENI devices are provided. In particular, TEENI devices include a support member having a length, at least one thread set comprising a plurality thread set arms having a plurality of electronic leads running through the thread set arms and being fully encapsulated within the support member, and a plurality of electrodes fixed to the plurality of thread set arms.

Abstract: Tissue-engineered nerve scaffolds, articles for up-selecting desired cell proliferation and down-selecting undesired cell proliferation, and methods of manufacturing the same are provided. The tissue-engineered nerve scaffold includes a hydrogel having a surface. The surface has a topography including a micropattern defined by a plurality of spaced features attached to or projected into the hydrogel. The micropattern facilitates attachment and alignment of neural cells and reduces attachment and alignment of cells associated with scar-tissue formation and encapsulation.

Abstract: Directed bioadhesion coatings, methods of forming directed bioadhesion coatings, and methods of directing bioadhesion are provided. In particular, methods of forming directed bioadhesion coatings include providing a substrate having a graft monomer layer on a surface thereof, selectively removing discrete portions of the graft monomer layer to expose the substrate surface, polymerizing any remaining portions of the graft monomer layer via reversible addition-fragmentation chain-transfer (RAFT) polymerization with a RAFT chain transfer agent to form a plurality of graft polymers, and simultaneously with polymerizing the remaining graft monomer layer, grafting the plurality of graft polymers to the substrate to form a chemical pattern on the substrate.

Abstract: Tissue-engineered electronic peripheral nerve interface (TEENI) devices, methods of using TEENI devices, and systems using TEENI devices are provided. In particular, TEENI devices include a support member having a length, at least one thread set comprising a plurality thread set arms having a plurality of electronic leads running through the thread set arms and being fully encapsulated within the support member, and a plurality of electrodes fixed to the plurality of thread set arms.