Patents by Inventor Cary G Addington
Cary G Addington has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220080652Abstract: In one example, a processor readable medium having instructions thereon that when executed cause an additive manufacturing machine to vary operating characteristics of a fusing laser beam at multiple different voxel locations in a layer of build material according to an energy dosage to be applied at each voxel location in an object slice, including multiple different energy dosages for corresponding multiple different voxel locations in the slice.Type: ApplicationFiled: November 24, 2021Publication date: March 17, 2022Inventors: Cary G. Addington, David A. Champion, Mohammed S. Shaarawi, James McKinnell, Diane R. Hammerstad
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Patent number: 11207827Abstract: In one example, a processor readable medium having instructions thereon that when executed cause an additive manufacturing machine to vary operating characteristics of a fusing laser beam at multiple different voxel locations in a layer of build material according to an energy dosage to be applied at each voxel location in an object slice, including multiple different energy dosages for corresponding multiple different voxel locations in the slice.Type: GrantFiled: March 29, 2017Date of Patent: December 28, 2021Assignee: Hewlett-Packard Development Company, L.P.Inventors: Cary G. Addington, David A. Champion, Mohammed S. Shaarawi, James McKinnell, Diane R. Hammerstad
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Publication number: 20210053278Abstract: In one example, a processor readable medium having instructions thereon that when executed cause an additive manufacturing machine to vary operating characteristics of a fusing laser beam at multiple different voxel locations in a layer of build material according to an energy dosage to be applied at each voxel location in an object slice, including multiple different energy dosages for corresponding multiple different voxel locations in the slice.Type: ApplicationFiled: March 29, 2017Publication date: February 25, 2021Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Cary G. ADDINGTON, David A. CHAMPION, Mohammed S. SHAARAWI, James McKINNELL, Diane R. HAMMERSTAD
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Patent number: 9291756Abstract: Embodiments disclosed herein relate to a filter (100). In one embodiment, the filter includes a pattern (120). The pattern may reflect or fluoresce non-visible light.Type: GrantFiled: January 28, 2011Date of Patent: March 22, 2016Assignee: Hewlett-Packard Development Company, L.P.Inventors: Daniel I. Croft, Barry T Phillips, Brad Benson, Cary G Addington, Angus Wu, Stephan R Clark, Guy Adams, James Stasiak
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Patent number: 8736645Abstract: A printhead and related fabrication method are described with the printhead including a spacer layer.Type: GrantFiled: July 8, 2009Date of Patent: May 27, 2014Assignee: Hewlett-Packard Development Company, L.P.Inventors: Napoleon J. Leoni, Omer Gila, Cary G. Addington, Paul H. McClelland, Henryk Birecki
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Publication number: 20130334441Abstract: Embodiments disclosed herein relate to a filter (100). In one embodiment, the filter includes a pattern (120). The pattern may reflect or fluoresce non-visible light.Type: ApplicationFiled: January 28, 2011Publication date: December 19, 2013Inventors: Daniel I. Croft, Bany T. Phillips, Brad Benson, Cary G. Addington, Angus Wu, Stephan R. Clark, Guy Adams
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Publication number: 20130021393Abstract: A static electronic display employs pixels having a plurality of subpixels that exhibit one of a minimum intensity and a maximum intensity of an intensity range of the image. The static electronic display includes an array of the pixels of an electrode patterned to represent image pixels of the image. A relative number of minimum intensity subpixels and maximum intensity subpixels of each pixel in the array corresponds to an intensity level of a corresponding image pixel of the image.Type: ApplicationFiled: July 22, 2011Publication date: January 24, 2013Inventors: Gregg A. Combs, Cary G. Addington
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Patent number: 8299708Abstract: In an embodiment, a pixel structure has an electrical conductor, a dielectric on the electrical conductor, a plurality of ribs on the dielectric, and a plurality of discrete protrusions protruding from a surface of each of the ribs. The plurality ribs define a plurality of compartments on the dielectric.Type: GrantFiled: October 25, 2010Date of Patent: October 30, 2012Assignee: Hewlett-Packard Development Company, L.P.Inventors: Vincent C Korthuis, Cary G Addington, Peter S Nyholm
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Publication number: 20120113206Abstract: Printhead fabrication methods and printheads are described. According to one aspect, a printhead fabrication method includes providing a spacer layer 36 over a plurality of bottom electrodes 10 of a printhead, providing a plurality of top electrodes 26 of the printhead over the spacer layer 36 and the bottom electrodes 10, aligning a plurality of printhead features 38 of the spacer layer 36 with a plurality of printhead features 28, 16 of the top electrodes 26 and the bottom electrodes 10, and bonding the spacer layer 36 with the top electrodes 26 and the bottom electrodes 10 with the printhead features 38 of the spacer layer 36 aligned with the printhead features 28, 16 of the top electrodes 26 and the bottom electrodes 10.Type: ApplicationFiled: July 8, 2009Publication date: May 10, 2012Applicant: Hewlett-Packard Development Company, L.P.Inventors: Napoleon J. Leoni, Omer Gila, Cary G. Addington, Paul H. McClelland, Henryk Birecki
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Publication number: 20120098406Abstract: In an embodiment, a pixel structure has an electrical conductor, a dielectric on the electrical conductor, a plurality of ribs on the dielectric, and a plurality of discrete protrusions protruding from a surface of each of the ribs. The plurality ribs define a plurality of compartments on the dielectric.Type: ApplicationFiled: October 25, 2010Publication date: April 26, 2012Inventors: Vincent C. Korthuis, Cary G. Addington, Peter S. Nyholm
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Patent number: 8115313Abstract: A plurality of electrodes are electrically coupled to each other by conductive interconnects formed from selectively sintered nanoparticles.Type: GrantFiled: October 12, 2006Date of Patent: February 14, 2012Assignee: Hewlett-Packard Development Company, L.P.Inventors: Jian-Gang Weng, Ravi Prasad, Cary G. Addington, Peter S. Nyholm
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Patent number: 8089686Abstract: In one embodiment, a device includes a first display element including: a first electrode; a transparent dielectric layer having recessed regions therein over the first electrode; a halftoned second electrode opposite the first electrode; and a fluid with colorant particles between the first electrode and the second electrode, wherein a voltage signal applied between the first electrode and the second electrode controls movement of the colorant particles such that a first voltage signal provides a clear optical state by compacting the colorant particles into the recessed regions and a second voltage signal provides a grayscale optical state by attracting the colorant particles to the second electrode.Type: GrantFiled: October 14, 2009Date of Patent: January 3, 2012Assignee: Hewlett-Packard Development Company, L.P.Inventors: Cary G. Addington, Jong-Souk Yeo
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Publication number: 20110085224Abstract: In one embodiment, a device includes a first display element including: a first electrode; a transparent dielectric layer having recessed regions therein over the first electrode; a halftoned second electrode opposite the first electrode; and a fluid with colorant particles between the first electrode and the second electrode, wherein a voltage signal applied between the first electrode and the second electrode controls movement of the colorant particles such that a first voltage signal provides a clear optical state by compacting the colorant particles into the recessed regions and a second voltage signal provides a grayscale optical state by attracting the colorant particles to the second electrode.Type: ApplicationFiled: October 14, 2009Publication date: April 14, 2011Inventors: Cary G. Addington, Jong-Souk Yeo
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Patent number: 7833426Abstract: The described embodiments relate to features in substrates and methods of forming same. One exemplary embodiment can be a microdevice that includes a substrate extending between a first substrate surface and a generally opposing second substrate surface, and at least one feature formed into the first surface along a bore axis that is not transverse to the first surface.Type: GrantFiled: May 11, 2007Date of Patent: November 16, 2010Assignee: Hewlett-Packard Development Company, L.P.Inventors: Leo C. Clarke, Chris Aschoff, Cary G. Addington
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Patent number: 7728425Abstract: One embodiment of an electronic component packaging system includes a base adapted for supporting an electronic component, a lid sealed to the base, the lid including a fillport, and the fillport hermetically sealed by light irradiation.Type: GrantFiled: June 21, 2005Date of Patent: June 1, 2010Assignee: Hewlett-Packard Development Company, L.P.Inventors: Cary G. Addington, Shell Elaine Whittington, Peter Mardilovich, William Wren
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Patent number: 7658470Abstract: A method of using a flexible circuit, including attaching a first portion of the flexible circuit, via an attaching surface of the flexible circuit, to a first surface of a chip carrier. Statically bending a bending portion of the flexible circuit around an edge formed at the intersection of the first surface of the chip carrier, and a second surface of the chip carrier. Adhesively attaching a second portion of the flexible circuit, via the attaching surface, to the second surface of the chip carrier, where the second portion of the flexible circuit has at least one first anchor structure formed in the attaching surface, where the at least one first anchor structure is adapted to accept an adhesive.Type: GrantFiled: April 28, 2005Date of Patent: February 9, 2010Assignee: Hewlett-Packard Development Company, L.P.Inventors: Brian Jones, Robert Weber, Cary G Addington, Si-Lam Choy
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Publication number: 20080257871Abstract: Embodiments of an ablation device and an ablation process are disclosed.Type: ApplicationFiled: April 20, 2007Publication date: October 23, 2008Inventors: Judson M. Leiser, Cary G. Addington, Michael French, William Wren
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Patent number: 7358169Abstract: A method is provided for depositing a patterning material onto an optically transparent substrate by the use of a laser beam. A solid layer of a patterning material is placed adjacent to a receiving surface of the substrate. A laser beam is directed at an incident angle between 0 and 90° relative to the receiving surface. The laser beam is transmitted through the substrate and onto the solid layer to cause patterning material from the solid layer to deposit onto the receiving surface of the substrate.Type: GrantFiled: April 13, 2005Date of Patent: April 15, 2008Assignee: Hewlett-Packard Development Company, L.P.Inventors: Lei Zhu, Seng Teng Khor, Qiong Chen, Cary G. Addington
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Patent number: 7332263Abstract: A method for laser patterning of a passive matrix organic light emitting diode device having a multilayered structure comprising a substrate and at least one light emitting organic layer disposed between two electrode layers, the method comprising the step of: irradiating areas of the multilayered structure with a laser beam in a predetermined pattern thereby causing ablation of the multilayered structure in the irradiated areas; wherein, the electrode layers and the light emitting organic layer or layers are patterned substantially simultaneously during the same irradiation operation. Also described are a passive matrix organic light emitting diode device patterned by the method of the present invention and a display comprising the same.Type: GrantFiled: April 22, 2004Date of Patent: February 19, 2008Assignee: Hewlett-Packard Development Company, L.P.Inventors: Cary G Addington, Qiong Chen
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Patent number: 7135405Abstract: Embodiments of methods, apparatuses, devices, and/or systems for forming an interconnect are described.Type: GrantFiled: August 4, 2004Date of Patent: November 14, 2006Assignee: Hewlett-Packard Development Company, L.P.Inventors: Jian-Gang Weng, Ravi Prasad, Cary G. Addington, Peter S. Nyholm