Abstract: An integrated circuit device includes a semiconductor component coupled with a lead frame, and an integrated circuit package encompassing at least a portion of the semiconductor component. The package has a first surface and a second surface, and side surfaces, where the first surface is opposite the second surface. A parting line of the integrated circuit package is offset toward the second surface of the package, where the first surface optionally comprises the bottom surface of the package. The first surface of the package has one or more recessed areas.

Abstract: A ball grid array assembly includes a package cover that encapsulates a die and a portion of a substrate to which the die is attached, including an edge of the substrate. Encapsulation of the substrate edge by the cover reduces penetration of moisture or other contaminants into the substrate. The cover includes a rib that extends to contact a circuit board to which the ball grid array assembly is connected. With such a rib, planarity between the circuit board and the substrate is maintained during soldering.

Abstract: A ball grid array assembly includes a package cover that encapsulates a die and a portion of a substrate to which the die is attached, including an edge of the substrate. Encapsulation of the substrate edge by the cover reduces penetration of moisture or other contaminants into the substrate. The cover includes a rib that extends to contact a circuit board to which the ball grid array assembly is connected. With such a rib, planarity between the circuit board and the substrate is maintained during soldering.

Abstract: A method and apparatus for encapsulating microelectronic devices. In one embodiment, a microelectronic device is engaged with a support member having a first edge, a second edge opposite the first edge, and an engaging surface with at least a portion of the engaging surface spaced apart from the first and second edges. The first edge of the support member is positioned proximate to a wall of a mold and an aligning member is moved relative to the wall of the mold to contact the engaging surface of the support member and bias the first edge of the support member against the wall of the mold. The microelectronic device is then encapsulated by disposing an encapsulating material in the mold adjacent to the microelectronic device. By biasing the first edge of the support member against the wall of the mold, the method can prevent encapsulating material from passing between the first edge of the support member and the wall of the mold, where the encapsulating material would otherwise form flash.

Abstract: A method and apparatus for encapsulating microelectronic devices. In one embodiment, a microelectronic device is engaged with a support member having a first edge, a second edge opposite the first edge, and an engaging surface with at least a portion of the engaging surface spaced apart from the first and second edges. The first edge of the support member is positioned proximate to a wall of a mold and an aligning member is moved relative to the wall of the mold to contact the engaging surface of the support member and bias the first edge of the support member against the wall of the mold. The microelectronic device is then encapsulated by disposing an encapsulating material in the mold adjacent to the microelectronic device. By biasing the first edge of the support member against the wall of the mold, the method can prevent encapsulating material from passing between the first edge of the support member and the wall of the mold, where the encapsulating material would otherwise form flash.

Abstract: A method and apparatus for encapsulating microelectronic devices. In one embodiment, a microelectronic device is engaged with a support member having a first edge, a second edge opposite the first edge, and an engaging surface with at least a portion of the engaging surface spaced apart from the first and second edges. The first edge of the support member is positioned proximate to a wall of a mold and an aligning member is moved relative to the wall of the mold to contact the engaging surface of the support member and bias the first edge of the support member against the wall of the mold. The microelectronic device is then encapsulated by disposing an encapsulating material in the mold adjacent to the microelectronic device. By biasing the first edge of the support member against the wall of the mold, the method can prevent encapsulating material from passing between the first edge of the support member and the wall of the mold, where the encapsulating material would otherwise form flash.

Abstract: A ball grid array assembly includes a package cover that encapsulates a die and a portion of a substrate to which the die is attached, including an edge of the substrate. Encapsulation of the substrate edge by the cover reduces penetration of moisture or other contaminants into the substrate. The cover includes a rib that extends to contact a circuit board to which the ball grid array assembly is connected. With such a rib, planarity between the circuit board and the substrate is maintained during soldering.