Abstract: An apparatus for cooling a heat-generating component is disclosed. The apparatus includes a cooling chamber containing a liquid metal. The cooling chamber has a heat-conducting wall thermally coupled to the heat-generating component. A plurality of extendable tubes making up an array of cooling pin fins is attached to the cooling chamber. Each of the extendable tubes has a port end that opens into the cooling chamber and a sealed end that projects away from the cooling chamber. Moreover, each of the extendable tubes has an extended position when filled with liquid metal from the cooling chamber and a retracted position when emptied of the liquid metal. A pump system is included for urging the liquid metal from the cooling chamber into the plurality of extendable tubes.

Abstract: A rack mount assembly measurement tool, for determining physical values including air flow and heat loads, includes a front assembly and a rear duct assembly that are non-intrusively and releasably mounted on the front and rear of such rack mount enclosure. Physical values are sensed at multiple vertical locations to enable a determination of overall and localized heat loads within the enclosure. Front sensor values are collected and wirelessly transmitted from the front assembly to a receiver/processor supported on the rear duct, which generates computed values that are displayed in addition to the sensed values.

Abstract: A rack mount assembly measurement tool, for determining physical values including air flow and heat loads, includes a front assembly and a rear duct assembly that are non-intrusively and releasably mounted on the front and rear of such rack mount enclosure. Physical values are sensed at multiple vertical locations to enable a determination of overall and localized heat loads within the enclosure. Front sensor values are collected and wirelessly transmitted from the front assembly to a receiver/processor supported on the rear duct, which generates computed values that are displayed in addition to the sensed values.

Abstract: An apparatus for cooling a heat-generating component is disclosed. The apparatus includes a cooling chamber containing a liquid metal. The cooling chamber has a heat-conducting wall thermally coupled to the heat-generating component. A plurality of extendable tubes making up an array of cooling pin fins is attached to the cooling chamber. Each of the extendable tubes has a port end that opens into the cooling chamber and a sealed end that projects away from the cooling chamber. Moreover, each of the extendable tubes has an extended position when filled with liquid metal from the cooling chamber and a retracted position when emptied of the liquid metal. A pump system is included for urging the liquid metal from the cooling chamber into the plurality of extendable tubes.

Abstract: A heat exchanger for use, e.g., in a rear door of a server rack in a computer room, made up of pipes clad with a layer of a phase change material, such as a paraffin, so that latent heat is absorbed in the conversion from the solid to the liquid state. Preferably, each pipe in turn is opened by a control valve and chilled coolant flows through the pipe until the phase change material reverts back to the solid state. Then, the control valve is again closed, and the phase change material is further heated by waste heat so that it is melted once more. Preferably, the control valve for only one pipe at a time is opened, so that latent heat is being absorbed by the phase change material around all pipes but one.

Abstract: The present invention is generally directed to an apparatus providing real time adaptive active fluid flow cooling, for cooling an electronic system, an electronic system utilizing the same, and a method for providing real time adaptive active fluid flow cooling. The electronic system consists of a circuit board having a heat generating component, a heat dissipating element mounted to the heat generating component and an apparatus for providing real time adaptive active flow cooling. The apparatus consisting of a plurality of active cooling devices that remove heated air or fluid with ambient air or fluid by propelling an fluid flow stream in a first direction toward the heat dissipating element, and where at least one active cooling device contained in the plurality of active cooling devices propels an fluid flow stream in a second direction toward the heat dissipating element.

Abstract: A heat exchanger for use, e.g., in a rear door of a server rack in a computer room, made up of pipes clad with a layer of a phase change material, such as a paraffin, so that latent heat is absorbed in the conversion from the solid to the liquid state. Preferably, each pipe in turn is opened by a control valve and chilled coolant flows through the pipe until the phase change material reverts back to the solid state. Then, the control valve is again closed, and the phase change material is further heated by waste heat so that it is melted once more. Preferably, the control valve for only one pipe at a time is opened, so that latent heat is being absorbed by the phase change material around all pipes but one.

Abstract: The present invention is generally directed to an apparatus providing real time adaptive active fluid flow cooling, for cooling an electronic system, an electronic system utilizing the same, and a method for providing real time adaptive active fluid flow cooling. The electronic system consists of a circuit board having a heat generating component, a heat dissipating element mounted to the heat generating component and an apparatus for providing real time adaptive active flow cooling. The apparatus consisting of a plurality of active cooling devices that remove heated air or fluid with ambient air or fluid by propelling an fluid flow stream in a first direction toward the heat dissipating element, and where at least one active cooling device contained in the plurality of active cooling devices propels an fluid flow stream in a second direction toward the heat dissipating element.

Abstract: An assembly, system, and method particularly adapted for a magnetic resonator apparatus in a magnetic resonance imaging (MRI) scanning system. Provided is a restraining assembly supportable by the supporting assembly and including at least a system that is selectively operable for positioning and restraining at least a portion of the body to be imaged, thereby optimizing image quality.

Abstract: A method and fire retardant structures including fire retardant spheres are provided for implementing enhanced fire protection. A selected first fire retardant material is encapsulated in microspheres. The microspheres have a predefined melting temperature within a defined temperature range. The fire retardant structure is formed of the microspheres encapsulating the selected fire retardant material and included in an article being produced. In response to a fire event, the microspheres rupture or decompose releasing the encapsulated material to provide fire suppression. Alternatively, a fire retardant structure is formed of second microspheres having predefined expansion characteristics. A layer of the second microspheres is disposed between two layers of an article being produced.

Abstract: A card edge connector assembly with a housing with side walls and a housing base portion embodying an unique card edge auto thickness detection mechanism that includes a pair of movable block members with interconnected upstanding auto thickness detection members and contact pins, a pair of spring members positioned between the movable blocks and interior wall portions of the housing and a pair of stabilizing tie rod members cooperatively associated with the movable blocks for allowing translational movement, while preventing rotation. Each movable block having an extending projection slidably received within longitudinal channels formed in the base housing portion for maintaining the auto thickness detection mechanism in a selected position. Upon insertion of PCI cards between the contact pins and the auto thickness detection members, the contact pins and the auto thickness detection members are moved away from one another against the spring members for accommodating card edges of varying thicknesses.

Abstract: The present invention is generally directed to an apparatus providing real time adaptive active fluid flow cooling, for cooling an electronic system, an electronic system utilizing the same, and a method for providing real time adaptive active fluid flow cooling. The electronic system consists of a circuit board having a heat generating component, a heat dissipating element mounted to the heat generating component and an apparatus for providing real time adaptive active flow cooling. The apparatus consisting of a plurality of active cooling devices that remove heated air or fluid with ambient air or fluid by propelling an fluid flow stream in a first direction toward the heat dissipating element, and where at least one active cooling device contained in the plurality of active cooling devices propels an fluid flow stream in a second direction toward the heat dissipating element.

Abstract: The present invention is generally directed to an apparatus providing real time adaptive active fluid flow cooling, for cooling an electronic system, an electronic system utilizing the same, and a method for providing real time adaptive active fluid flow cooling. The electronic system consists of a circuit board having a heat generating component, a heat dissipating element mounted to the heat generating component and an apparatus for providing real time adaptive active flow cooling. The apparatus consisting of a plurality of active cooling devices that remove heated air or fluid with ambient air or fluid by propelling an fluid flow stream in a first direction toward the heat dissipating element, and where at least one active cooling device contained in the plurality of active cooling devices propels an fluid flow stream in a second direction toward the heat dissipating element.

Abstract: The present invention is generally directed to an apparatus providing real time adaptive active fluid flow cooling, for cooling an electronic system, an electronic system utilizing the same, and a method for providing real time adaptive active fluid flow cooling. The electronic system consists of a circuit board having a heat generating component, a heat dissipating element mounted to the heat generating component and an apparatus for providing real time adaptive active flow cooling. The apparatus consisting of a plurality of active cooling devices that remove heated air or fluid with ambient air or fluid by propelling an fluid flow stream in a first direction toward the heat dissipating element, and where at least one active cooling device contained in the plurality of active cooling devices propels an fluid flow stream in a second direction toward the heat dissipating element.

Abstract: Air moving device (AMD) packaging apparatus includes an AMD carriage structure and an associated frame receiving the AMD carriage structure. The AMD carriage structure includes an AMD holder section pivotally connected to a driver section. The associated frame is mounted in a housing of a system to be cooled and includes elongated slots defining cooperating tracks for receiving the AMD carriage structure. The AMD holder section and the driver section include outwardly extending protrusions or posts slideably received within the cooperating tracks in the associated frame to position an AMD contained within the AMD holder section in an operating position within the associated frame.

Abstract: In a system for liquid cooling of electronics, where the electronics are subject to rotation in space, a liquid coolant storage tank includes a degassing and vortex-preventing structure to allow bubbles to float to the surface of the liquid inside the tank, and also to prevent vortices from forming near the outlet from the tank. The structure includes nested tubes or conduits. An inner conduit extends from the inlet into the tank, and its open end is covered by a second conduit with a baffle across its end, so that the flow is directed by the baffle to flow back along the outside of the inner conduit, and inside of the outer conduit. Especially at the inlet, a third conduit with large perforations surrounds the open end of the outer conduit. Smaller perforations on the inner conduit at the outlet side discourage any vortex from forming there. Reversal of the liquid flow, and the gradual increase in flow cross section prevent surging inside the tank.

Abstract: A method and modular mechanism are provided for protecting fiber optic cables. The modular mechanism includes an inner member for receiving the fiber optic cable, and an outer container receiving and retaining the inner member, such as, an inner tube and outer tube. The inner member and the outer container have predefined shapes to create an interference with each other, limiting a bend radius of the fiber optic cable.

Abstract: A novel conductive gasket including an internal contact-enhancing strip provides improved contact performance in electromagnetic interference prevention and other applications. A metal mesh or conductive plastic covers a substantially rigid internal strip that includes protrusions that either bend or penetrate the gasket cover in order to enhance contact with another conductive surface. The cover may include holes aligned with the protrusions so that the protrusions pass through the holes when the gasket is compressed, or the protrusions may penetrate a mesh or plastic cover. An internal foam piece may be provided behind the internal strip to restore the shape of the when compressive force is removed and a second internal foam piece may be provided between the strip and the cover for maintaining the shape of the gasket.

Abstract: A method, system, and apparatus are disclosed for handling fluid flow in a computer system for suppressing noise and heat, and, in addition, for enhancing external cable management for use with the computer system.

Abstract: A method, system, and apparatus are disclosed for handling fluid flow in a computer system for suppressing noise and heat, and, in addition, for enhancing external cable management for use with the computer system.