Patents by Inventor Casey Feinstein

Casey Feinstein has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thin glass for touch panel sensors and methods therefor
    Patent number: 9213451
    Abstract: Improved techniques are disclosed for fabrication of touch panels using thin sheet glass, coupling external circuitry, and securely holding the touch panel within a portable electronic device. The thin sheet glass may be chemically strengthened and laser scribed.
    Type: Grant
    Filed: September 30, 2010
    Date of Patent: December 15, 2015
    Assignee: Apple Inc.
    Inventors: Silvio Grespan, Casey Feinstein, Kuo-Hua Sung, John Z. Zhong
  • Method for selectively treating surfaces
    Patent number: 9046684
    Abstract: A method of treating a surface includes providing an object and applying a masking layer to a target surface area of the object. A sacrificial material is applied to a non-target surface area of the object. The method also includes removing the masking layer from the target surface area. The target surface area is exposed to a substance that etches or coats the target surface area. The sacrificial material from the non-target surface area of the object is removed, leaving the target surface area of the object etched or coated by the substance while the non-target surface area is not etched or coated by the substance.
    Type: Grant
    Filed: July 12, 2012
    Date of Patent: June 2, 2015
    Assignee: Google Inc.
    Inventors: Casey Feinstein, Matthieu Liger, Chia-Jean Wang
  • 3-dimensional curved substrate lamination
    Patent number: 8857490
    Abstract: A method of laminating a surface of a flexible material to a surface of a rigid, curved material. The method includes pressing an area of the surface of the flexible material into the surface of the rigid, curved material with a holder to create a contact area while the flexible material is conformed to the holder, which has a curvature greater than a curvature of the rigid, curved material surface; and changing the contact area between the surface of the flexible material and the surface of the rigid, curved material while maintaining pressure on the contact area until the surface of the flexible material and the surface of the rigid curved material are laminated.
    Type: Grant
    Filed: May 1, 2012
    Date of Patent: October 14, 2014
    Assignee: Apple Inc.
    Inventors: Kuo-Hua Sung, Troy Edwards, Casey Feinstein, John Zhong, Steven Porter Hotelling, Andrew David Lauder
  • 3-DIMENSIONAL CURVED SUBSTRATE LAMINATION
    Publication number: 20120211148
    Abstract: A method of laminating a surface of a flexible material to a surface of a rigid, curved material. The method includes pressing an area of the surface of the flexible material into the surface of the rigid, curved material with a holder to create a contact area while the flexible material is conformed to the holder, which has a curvature greater than a curvature of the rigid, curved material surface; and changing the contact area between the surface of the flexible material and the surface of the rigid, curved material while maintaining pressure on the contact area until the surface of the flexible material and the surface of the rigid curved material are laminated.
    Type: Application
    Filed: May 1, 2012
    Publication date: August 23, 2012
    Inventors: Kuo-Hua SUNG, Troy Edwards, Casey Feinstein, John Zhong, Steven Porter Hotelling, Andrew David Lauder
  • 3-dimensional curved substrate lamination
    Patent number: 8123894
    Abstract: A method of laminating a surface of a flexible material to a surface of a rigid, curved material. The method includes pressing an area of the surface of the flexible material into the surface of the rigid, curved material with a holder to create a contact area while the flexible material is conformed to the holder, which has a curvature greater than a curvature of the rigid, curved material surface; and changing the contact area between the surface of the flexible material and the surface of the rigid, curved material while maintaining pressure on the contact area until the surface of the flexible material and the surface of the rigid curved material are laminated.
    Type: Grant
    Filed: September 24, 2008
    Date of Patent: February 28, 2012
    Assignee: Apple Inc.
    Inventors: Kuo Sung, Troy Edwards, Casey Feinstein, John Zhong, Steve Porter Hotelling, Andrew David Lauder
  • Thin Glass for Touch Panel Sensors and Methods Therefor
    Publication number: 20110300908
    Abstract: Improved techniques are disclosed for fabrication of touch panels using thin sheet glass, coupling external circuitry, and securely holding the touch panel within a portable electronic device. The thin sheet glass may be chemically strengthened and laser scribed.
    Type: Application
    Filed: September 30, 2010
    Publication date: December 8, 2011
    Inventors: Silvio Grespan, Casey Feinstein, Kuo-Hua Sung, John Z. Zhong
  • 3-DIMENSIONAL CURVED SUBSTRATE LAMINATION
    Publication number: 20100282416
    Abstract: A method of laminating a surface of a flexible material to a surface of a rigid, curved material. The method includes pressing an area of the surface of the flexible material into the surface of the rigid, curved material with a holder to create a contact area while the flexible material is conformed to the holder, which has a curvature greater than a curvature of the rigid, curved material surface; and changing the contact area between the surface of the flexible material and the surface of the rigid, curved material while maintaining pressure on the contact area until the surface of the flexible material and the surface of the rigid curved material are laminated.
    Type: Application
    Filed: July 23, 2010
    Publication date: November 11, 2010
    Inventors: Kuo SUNG, Troy Edwards, Casey Feinstein, John Zhong, Steve Porter Hotelling, Andrew David Lauder
  • 3-Dimensional Curved Substrate Lamination
    Publication number: 20090277578
    Abstract: A method of laminating a surface of a flexible material to a surface of a rigid, curved material. The method includes pressing an area of the surface of the flexible material into the surface of the rigid, curved material with a holder to create a contact area while the flexible material is conformed to the holder, which has a curvature greater than a curvature of the rigid, curved material surface; and changing the contact area between the surface of the flexible material and the surface of the rigid, curved material while maintaining pressure on the contact area until the surface of the flexible material and the surface of the rigid curved material are laminated.
    Type: Application
    Filed: September 24, 2008
    Publication date: November 12, 2009
    Inventors: Kuo Sung, Troy Edwards, Casey Feinstein, John Zhong, Steve Porter Hotelling, Andrew David Lauder
  • Method and apparatus for characterizing microelectromechanical devices on wafers
    Patent number: 7345806
    Abstract: The invention provides a method and apparatus for evaluating the quality of microelectromechanical devices having deformable and deflectable members using resonation techniques. Specifically, product quality characterized in terms of uniformity of the deformable and deflectable elements is inspected with an optical resonance mapping mechanism on a wafer-level.
    Type: Grant
    Filed: June 23, 2004
    Date of Patent: March 18, 2008
    Assignee: Texas Instruments Incorporated
    Inventors: Dmitri Simonian, Casey Feinstein
  • Method and apparatus for characterizing microelectromechanical devices on wafers
    Publication number: 20050286105
    Abstract: The invention provides a method and apparatus for evaluating the quality of microelectromechanical devices having deformable and deflectable members using resonation techniques. Specifically, product quality characterized in terms of uniformity of the deformable and deflectable elements is inspected with an optical resonance mapping mechanism on a wafer-level.
    Type: Application
    Filed: June 23, 2004
    Publication date: December 29, 2005
    Inventors: Dmitri Simonian, Casey Feinstein