Patents by Inventor Casey Kurth

Casey Kurth has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10431714
    Abstract: Engineered substrates for semiconductor devices are disclosed herein. A device in accordance with a particular embodiment includes a transducer structure having a plurality of semiconductor materials including a radiation-emitting active region. The device further includes an engineered substrate having a first material and a second material, at least one of the first material and the second material having a coefficient of thermal expansion at least approximately matched to a coefficient of thermal expansion of at least one of the plurality of semiconductor materials. At least one of the first material and the second material is positioned to receive radiation from the active region and modify a characteristic of the light.
    Type: Grant
    Filed: February 5, 2016
    Date of Patent: October 1, 2019
    Assignee: Qromis, Inc.
    Inventors: Martin F. Schubert, Cem Basceri, Vladimir Odnoblyudov, Casey Kurth, Thomas Gehrke
  • Publication number: 20180358344
    Abstract: Solid state lights (SSLs) including a back-to-back solid state emitters (SSEs) and associated methods are disclosed herein. In various embodiments, an SSL can include a carrier substrate having a first surface and a second surface different from the first surface. First and second through substrate interconnects (TSIs) can extend from the first surface of the carrier substrate to the second surface. The SSL can further include a first and a second SSE, each having a front side and a back side opposite the front side. The back side of the first SSE faces the first surface of the carrier substrate and the first SSE is electrically coupled to the first and second TSIs. The back side of the second SSE faces the second surface of the carrier substrate and the second SSE is electrically coupled to the first and second TSIs.
    Type: Application
    Filed: July 26, 2018
    Publication date: December 13, 2018
    Inventors: Cem Basceri, Casey Kurth, Kevin Tetz
  • Patent number: 10062677
    Abstract: Solid state lights (SSLs) including a back-to-back solid state emitters (SSEs) and associated methods are disclosed herein. In various embodiments, an SSL can include a carrier substrate having a first surface and a second surface different from the first surface. First and second through substrate interconnects (TSIs) can extend from the first surface of the carrier substrate to the second surface. The SSL can further include a first and a second SSE, each having a front side and a back side opposite the front side. The back side of the first SSE faces the first surface of the carrier substrate and the first SSE is electrically coupled to the first and second TSIs. The back side of the second SSE faces the second surface of the carrier substrate and the second SSE is electrically coupled to the first and second TSIs.
    Type: Grant
    Filed: August 30, 2016
    Date of Patent: August 28, 2018
    Assignee: Micron Technology, Inc.
    Inventors: Cem Basceri, Casey Kurth, Kevin Tetz
  • Patent number: 9698329
    Abstract: Solid-state lighting devices (SSLDs) including a carrier substrate with conductors and methods of manufacturing SSLDs. The conductors can provide (a) improved thermal conductivity between a solid-state light emitter (SSLE) and a package substrate and (b) improved electrical conductivity for the SSLE. In one embodiment, the conductors have higher thermal and electrical conductivities than the carrier substrate supporting the SSLE.
    Type: Grant
    Filed: August 12, 2015
    Date of Patent: July 4, 2017
    Assignee: Quora Technology, Inc.
    Inventors: Scott D. Schellhammer, Scott E. Sills, Casey Kurth
  • Patent number: 9620670
    Abstract: Solid state lighting dies and associated methods of manufacturing are disclosed herein. In one embodiment, a solid state lighting die includes a substrate material, a first semiconductor material, a second semiconductor material, and an active region between the first and second semiconductor materials. The second semiconductor material has a surface facing away from the substrate material. The solid state lighting die also includes a plurality of openings extending from the surface of the second semiconductor material toward the substrate material.
    Type: Grant
    Filed: September 2, 2010
    Date of Patent: April 11, 2017
    Assignee: Micron Technology, Inc.
    Inventors: Cem Basceri, Casey Kurth, Thomas Gehrke, Kevin Tetz
  • Publication number: 20160372451
    Abstract: Solid state lights (SSLs) including a back-to-back solid state emitters (SSEs) and associated methods are disclosed herein. In various embodiments, an SSL can include a carrier substrate having a first surface and a second surface different from the first surface. First and second through substrate interconnects (TSIs) can extend from the first surface of the carrier substrate to the second surface. The SSL can further include a first and a second SSE, each having a front side and a back side opposite the front side. The back side of the first SSE faces the first surface of the carrier substrate and the first SSE is electrically coupled to the first and second TSIs. The back side of the second SSE faces the second surface of the carrier substrate and the second SSE is electrically coupled to the first and second TSIs.
    Type: Application
    Filed: August 30, 2016
    Publication date: December 22, 2016
    Inventors: Cem Basceri, Casey Kurth, Kevin Tetz
  • Patent number: 9443834
    Abstract: Solid state lights (SSLs) including a back-to-back solid state emitters (SSEs) and associated methods are disclosed herein. In various embodiments, an SSL can include a carrier substrate having a first surface and a second surface different from the first surface. First and second through substrate interconnects (TSIs) can extend from the first surface of the carrier substrate to the second surface. The SSL can further include a first and a second SSE, each having a front side and a back side opposite the front side. The back side of the first SSE faces the first surface of the carrier substrate and the first SSE is electrically coupled to the first and second TSIs. The back side of the second SSE faces the second surface of the carrier substrate and the second SSE is electrically coupled to the first and second TSIs.
    Type: Grant
    Filed: September 2, 2010
    Date of Patent: September 13, 2016
    Assignee: Micron Technology, Inc.
    Inventors: Cem Basceri, Casey Kurth, Kevin Tetz
  • Publication number: 20160155893
    Abstract: Engineered substrates for semiconductor devices are disclosed herein. A device in accordance with a particular embodiment includes a transducer structure having a plurality of semiconductor materials including a radiation-emitting active region. The device further includes an engineered substrate having a first material and a second material, at least one of the first material and the second material having a coefficient of thermal expansion at least approximately matched to a coefficient of thermal expansion of at least one of the plurality of semiconductor materials. At least one of the first material and the second material is positioned to receive radiation from the active region and modify a characteristic of the light.
    Type: Application
    Filed: February 5, 2016
    Publication date: June 2, 2016
    Inventors: Martin F. Schubert, Cem Basceri, Vladimir Odnoblyudov, Casey Kurth, Thomas Gehrke
  • Patent number: 9293678
    Abstract: Solid-state lighting devices (SSLDs) including a carrier substrate with conductors and methods of manufacturing SSLDs. The conductors can provide (a) improved thermal conductivity between a solid-state light emitter (SSLE) and a package substrate and (b) improved electrical conductivity for the SSLE. In one embodiment, the conductors have higher thermal and electrical conductivities than the carrier substrate supporting the SSLE.
    Type: Grant
    Filed: July 15, 2010
    Date of Patent: March 22, 2016
    Assignee: Micron Technology, Inc.
    Inventors: Scott D. Schellhammer, Scott E. Sills, Casey Kurth
  • Publication number: 20160072016
    Abstract: Solid-state lighting devices (SSLDs) including a carrier substrate with conductors and methods of manufacturing SSLDs. The conductors can provide (a) improved thermal conductivity between a solid-state light emitter (SSLE) and a package substrate and (b) improved electrical conductivity for the SSLE. In one embodiment, the conductors have higher thermal and electrical conductivities than the carrier substrate supporting the SSLE.
    Type: Application
    Filed: August 12, 2015
    Publication date: March 10, 2016
    Inventors: Scott D. Schellhammer, Scott E. Sills, Casey Kurth
  • Patent number: 9269858
    Abstract: Engineered substrates for semiconductor devices are disclosed herein. A device in accordance with a particular embodiment includes a transducer structure having a plurality of semiconductor materials including a radiation-emitting active region. The device further includes an engineered substrate having a first material and a second material, at least one of the first material and the second material having a coefficient of thermal expansion at least approximately matched to a coefficient of thermal expansion of at least one of the plurality of semiconductor materials. At least one of the first material and the second material is positioned to receive radiation from the active region and modify a characteristic of the light.
    Type: Grant
    Filed: August 31, 2011
    Date of Patent: February 23, 2016
    Assignee: Micron Technology, Inc.
    Inventors: Martin F. Schubert, Cem Basceri, Vladimir Odnoblyudov, Casey Kurth, Thomas Gehrke
  • Publication number: 20130049043
    Abstract: Engineered substrates for semiconductor devices are disclosed herein. A device in accordance with a particular embodiment includes a transducer structure having a plurality of semiconductor materials including a radiation-emitting active region. The device further includes an engineered substrate having a first material and a second material, at least one of the first material and the second material having a coefficient of thermal expansion at least approximately matched to a coefficient of thermal expansion of at least one of the plurality of semiconductor materials. At least one of the first material and the second material is positioned to receive radiation from the active region and modify a characteristic of the light.
    Type: Application
    Filed: August 31, 2011
    Publication date: February 28, 2013
    Applicant: MICRON TECHNOLOGY, INC.
    Inventors: Martin F. Schubert, Cem Basceri, Vladimir Odnoblyudov, Casey Kurth, Thomas Gehrke
  • Publication number: 20120056219
    Abstract: Solid state lights (SSLs) including a back-to-back solid state emitters (SSEs) and associated methods are disclosed herein. In various embodiments, an SSL can include a carrier substrate having a first surface and a second surface different from the first surface. First and second through substrate interconnects (TSIs) can extend from the first surface of the carrier substrate to the second surface. The SSL can further include a first and a second SSE, each having a front side and a back side opposite the front side. The back side of the first SSE faces the first surface of the carrier substrate and the first SSE is electrically coupled to the first and second TSIs. The back side of the second SSE faces the second surface of the carrier substrate and the second SSE is electrically coupled to the first and second TSIs.
    Type: Application
    Filed: September 2, 2010
    Publication date: March 8, 2012
    Applicant: MICRON TECHNOLOGY, INC.
    Inventors: Cem Basceri, Casey Kurth, Kevin Tetz
  • Publication number: 20120056206
    Abstract: Solid state lighting dies and associated methods of manufacturing are disclosed herein. In one embodiment, a solid state lighting die includes a substrate material, a first semiconductor material, a second semiconductor material, and an active region between the first and second semiconductor materials. The second semiconductor material has a surface facing away from the substrate material. The solid state lighting die also includes a plurality of openings extending from the surface of the second semiconductor material toward the substrate material.
    Type: Application
    Filed: September 2, 2010
    Publication date: March 8, 2012
    Applicant: MICRON TECHNOLOGY, INC.
    Inventors: Cem Basceri, Casey Kurth, Thomas Gehrke, Kevin Tetz
  • Publication number: 20120012855
    Abstract: Solid-state lighting devices (SSLDs) including a carrier substrate with conductors and methods of manufacturing SSLDs. The conductors can provide (a) improved thermal conductivity between a solid-state light emitter (SSLE) and a package substrate and (b) improved electrical conductivity for the SSLE. In one embodiment, the conductors have higher thermal and electrical conductivities than the carrier substrate supporting the SSLE.
    Type: Application
    Filed: July 15, 2010
    Publication date: January 19, 2012
    Applicant: MICRON TECHNOLOGY, INC.
    Inventors: Scott D. Schellhammer, Scott E. Sills, Casey Kurth
  • Patent number: 7366946
    Abstract: Redundancy in a read only memory (ROM) embedded dynamic random access memory (DRAM) is accomplished by programming redundancy elements such as antifuses or registers with ROM data which is read instead of erroneous data. Multiple identical arrays of ROM bits can also be used for redundancy.
    Type: Grant
    Filed: February 6, 2007
    Date of Patent: April 29, 2008
    Assignee: Micron Technology, Inc.
    Inventors: Scott Derner, Casey Kurth, Phillip G. Wald
  • Publication number: 20070168783
    Abstract: Redundancy in a read only memory (ROM) embedded dynamic random access memory (DRAM) is accomplished by programming redundancy elements such as antifuses or registers with ROM data which is read instead of erroneous data. Multiple identical arrays of ROM bits can also be used for redundancy.
    Type: Application
    Filed: February 6, 2007
    Publication date: July 19, 2007
    Inventors: Scott Derner, Casey Kurth, Phillip Wald
  • Patent number: 7218547
    Abstract: A ROM embedded DRAM provides ROM cells that can be electrically programmed to a data state using DRAM capacitor memory cells. Numerous techniques for reading the memory cells are provided if a single state memory is desired. For example, bias techniques allow un-programmed ROM cells to be read accurately. In one embodiment, the memory includes program circuitry to short capacitor plates together by breaking down an intermediate dielectric layer using anti-fuse programming techniques.
    Type: Grant
    Filed: May 11, 2004
    Date of Patent: May 15, 2007
    Assignee: Micron Technology, Inc.
    Inventors: Casey Kurth, Scott Derner, Phillip G. Wald
  • Patent number: 7174477
    Abstract: Redundancy in a read only memory (ROM) embedded dynamic random access memory (DRAM) is accomplished by programming redundancy elements such as antifuses or registers with ROM data which is read instead of erroneous data. Multiple identical arrays of ROM bits can also be used for redundancy.
    Type: Grant
    Filed: February 4, 2003
    Date of Patent: February 6, 2007
    Assignee: Micron Technology, Inc.
    Inventors: Scott Derner, Casey Kurth, Phillip G. Wald
  • Patent number: 7099212
    Abstract: A ROM embedded DRAM provides ROM cells that can be programmed to a single state. The ROM cells include capacitors having a storage node. The storage node is processed to have a substantially high substrate leakage. The ROM cells, therefore, are hard programmed to a logic zero state. Bias techniques can be used to read un-programmed ROM cells accurately. As described, sense amplifier circuitry can be offset in one embodiment to default to the un-programmed state. In another embodiment, bias circuitry is coupled to bit lines to favor the un-programmed state. A differential pre-charge operation can also be used in another embodiment.
    Type: Grant
    Filed: August 23, 2004
    Date of Patent: August 29, 2006
    Assignee: Micron Technology, Inc.
    Inventors: Casey Kurth, Scott Derner, Phillip G. Wald