Patents by Inventor Casey Kurth
Casey Kurth has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250212476Abstract: An engineered substrate includes a polycrystalline ceramic core, a first adhesion layer coupled to the polycrystalline ceramic core, a conductive layer coupled to the first adhesion layer, a second adhesion layer coupled to the conductive layer, a diffusion barrier layer coupled to the second adhesion layer, and a bonding layer coupled to the diffusion barrier layer. The engineered substrate also includes a substantially single crystal layer coupled to the bonding layer. A first region of the engineered substrate includes an epitaxial III-V layer coupled to the substantially single crystal layer. A second region of the engineered substrate includes a eutectic barrier layer coupled to the bonding layer, a planarization layer coupled to the eutectic barrier layer, and an epitaxial III-V layer coupled to the planarization layer.Type: ApplicationFiled: December 20, 2024Publication date: June 26, 2025Applicant: QROMIS, Inc.Inventors: Vladimir Odnoblyudov, Cem Basceri, Casey Kurth
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Publication number: 20250212477Abstract: An engineered substrate includes a polycrystalline ceramic core having a device surface and a support surface opposite the device surface and a polycrystalline layer free of a binding agent coupled to the device surface. The polycrystalline grains can include aluminum nitride and the binding agent can include yttrium aluminum garnet. The polycrystalline layer can consist of aluminum nitride and be free of yttrium. An engineered substrate with a polycrystalline shell includes a polycrystalline ceramic core having a device surface, a support surface opposite the device surface, and peripheral surfaces extending between the device surface and the support surface. The engineered substrate with a polycrystalline shell also includes a polycrystalline shell free of a binding agent encapsulating the polycrystalline ceramic core.Type: ApplicationFiled: December 23, 2024Publication date: June 26, 2025Applicant: QROMIS, Inc.Inventors: Vladimir Odnoblyudov, Cem Basceri, Casey Kurth
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Publication number: 20250140774Abstract: Solid state lights (SSLs) including a back-to-back solid state emitters (SSEs) and associated methods are disclosed herein. In various embodiments, an SSL can include a carrier substrate having a first surface and a second surface different from the first surface. First and second through substrate interconnects (TSIs) can extend from the first surface of the carrier substrate to the second surface. The SSL can further include a first and a second SSE, each having a front side and a back side opposite the front side. The back side of the first SSE faces the first surface of the carrier substrate and the first SSE is electrically coupled to the first and second TSIs. The back side of the second SSE faces the second surface of the carrier substrate and the second SSE is electrically coupled to the first and second TSIs.Type: ApplicationFiled: January 6, 2025Publication date: May 1, 2025Inventors: Cem Basceri, Casey Kurth, Kevin Tetz
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Patent number: 12191298Abstract: Solid state lights (SSLs) including a back-to-back solid state emitters (SSEs) and associated methods are disclosed herein. In various embodiments, an SSL can include a carrier substrate having a first surface and a second surface different from the first surface. First and second through substrate interconnects (TSIs) can extend from the first surface of the carrier substrate to the second surface. The SSL can further include a first and a second SSE, each having a front side and a back side opposite the front side. The back side of the first SSE faces the first surface of the carrier substrate and the first SSE is electrically coupled to the first and second TSIs. The back side of the second SSE faces the second surface of the carrier substrate and the second SSE is electrically coupled to the first and second TSIs.Type: GrantFiled: June 23, 2023Date of Patent: January 7, 2025Assignee: Micron Technology, Inc.Inventors: Cem Basceri, Casey Kurth, Kevin Tetz
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Publication number: 20230352470Abstract: Solid state lights (SSLs) including a back-to-back solid state emitters (SSEs) and associated methods are disclosed herein. In various embodiments, an SSL can include a carrier substrate having a first surface and a second surface different from the first surface. First and second through substrate interconnects (TSIs) can extend from the first surface of the carrier substrate to the second surface. The SSL can further include a first and a second SSE, each having a front side and a back side opposite the front side. The back side of the first SSE faces the first surface of the carrier substrate and the first SSE is electrically coupled to the first and second TSIs. The back side of the second SSE faces the second surface of the carrier substrate and the second SSE is electrically coupled to the first and second TSIs.Type: ApplicationFiled: June 23, 2023Publication date: November 2, 2023Inventors: Cem Basceri, Casey Kurth, Kevin Tetz
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Patent number: 11710732Abstract: Solid state lights (SSLs) including a back-to-back solid state emitters (SSEs) and associated methods are disclosed herein. In various embodiments, an SSL can include a carrier substrate having a first surface and a second surface different from the first surface. First and second through substrate interconnects (TSIs) can extend from the first surface of the carrier substrate to the second surface. The SSL can further include a first and a second SSE, each having a front side and a back side opposite the front side. The back side of the first SSE faces the first surface of the carrier substrate and the first SSE is electrically coupled to the first and second TSIs. The back side of the second SSE faces the second surface of the carrier substrate and the second SSE is electrically coupled to the first and second TSIs.Type: GrantFiled: May 25, 2021Date of Patent: July 25, 2023Assignee: Micron Technology, Inc.Inventors: Cem Basceri, Casey Kurth, Kevin Tetz
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Publication number: 20210288041Abstract: Solid state lights (SSLs) including a back-to-back solid state emitters (SSEs) and associated methods are disclosed herein. In various embodiments, an SSL can include a carrier substrate having a first surface and a second surface different from the first surface. First and second through substrate interconnects (TSIs) can extend from the first surface of the carrier substrate to the second surface. The SSL can further include a first and a second SSE, each having a front side and a back side opposite the front side. The back side of the first SSE faces the first surface of the carrier substrate and the first SSE is electrically coupled to the first and second TSIs. The back side of the second SSE faces the second surface of the carrier substrate and the second SSE is electrically coupled to the first and second TSIs.Type: ApplicationFiled: May 25, 2021Publication date: September 16, 2021Inventors: Cem Basceri, Casey Kurth, Kevin Tetz
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Patent number: 11037918Abstract: Solid state lights (SSLs) including a back-to-back solid state emitters (SSEs) and associated methods are disclosed herein. In various embodiments, an SSL can include a carrier substrate having a first surface and a second surface different from the first surface. First and second through substrate interconnects (TSIs) can extend from the first surface of the carrier substrate to the second surface. The SSL can further include a first and a second SSE, each having a front side and a back side opposite the front side. The back side of the first SSE faces the first surface of the carrier substrate and the first SSE is electrically coupled to the first and second TSIs. The back side of the second SSE faces the second surface of the carrier substrate and the second SSE is electrically coupled to the first and second TSIs.Type: GrantFiled: July 26, 2018Date of Patent: June 15, 2021Assignee: Micron Technology, Inc.Inventors: Cem Basceri, Casey Kurth, Kevin Tetz
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Patent number: 10431714Abstract: Engineered substrates for semiconductor devices are disclosed herein. A device in accordance with a particular embodiment includes a transducer structure having a plurality of semiconductor materials including a radiation-emitting active region. The device further includes an engineered substrate having a first material and a second material, at least one of the first material and the second material having a coefficient of thermal expansion at least approximately matched to a coefficient of thermal expansion of at least one of the plurality of semiconductor materials. At least one of the first material and the second material is positioned to receive radiation from the active region and modify a characteristic of the light.Type: GrantFiled: February 5, 2016Date of Patent: October 1, 2019Assignee: Qromis, Inc.Inventors: Martin F. Schubert, Cem Basceri, Vladimir Odnoblyudov, Casey Kurth, Thomas Gehrke
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Publication number: 20180358344Abstract: Solid state lights (SSLs) including a back-to-back solid state emitters (SSEs) and associated methods are disclosed herein. In various embodiments, an SSL can include a carrier substrate having a first surface and a second surface different from the first surface. First and second through substrate interconnects (TSIs) can extend from the first surface of the carrier substrate to the second surface. The SSL can further include a first and a second SSE, each having a front side and a back side opposite the front side. The back side of the first SSE faces the first surface of the carrier substrate and the first SSE is electrically coupled to the first and second TSIs. The back side of the second SSE faces the second surface of the carrier substrate and the second SSE is electrically coupled to the first and second TSIs.Type: ApplicationFiled: July 26, 2018Publication date: December 13, 2018Inventors: Cem Basceri, Casey Kurth, Kevin Tetz
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Patent number: 10062677Abstract: Solid state lights (SSLs) including a back-to-back solid state emitters (SSEs) and associated methods are disclosed herein. In various embodiments, an SSL can include a carrier substrate having a first surface and a second surface different from the first surface. First and second through substrate interconnects (TSIs) can extend from the first surface of the carrier substrate to the second surface. The SSL can further include a first and a second SSE, each having a front side and a back side opposite the front side. The back side of the first SSE faces the first surface of the carrier substrate and the first SSE is electrically coupled to the first and second TSIs. The back side of the second SSE faces the second surface of the carrier substrate and the second SSE is electrically coupled to the first and second TSIs.Type: GrantFiled: August 30, 2016Date of Patent: August 28, 2018Assignee: Micron Technology, Inc.Inventors: Cem Basceri, Casey Kurth, Kevin Tetz
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Patent number: 9698329Abstract: Solid-state lighting devices (SSLDs) including a carrier substrate with conductors and methods of manufacturing SSLDs. The conductors can provide (a) improved thermal conductivity between a solid-state light emitter (SSLE) and a package substrate and (b) improved electrical conductivity for the SSLE. In one embodiment, the conductors have higher thermal and electrical conductivities than the carrier substrate supporting the SSLE.Type: GrantFiled: August 12, 2015Date of Patent: July 4, 2017Assignee: Quora Technology, Inc.Inventors: Scott D. Schellhammer, Scott E. Sills, Casey Kurth
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Patent number: 9620670Abstract: Solid state lighting dies and associated methods of manufacturing are disclosed herein. In one embodiment, a solid state lighting die includes a substrate material, a first semiconductor material, a second semiconductor material, and an active region between the first and second semiconductor materials. The second semiconductor material has a surface facing away from the substrate material. The solid state lighting die also includes a plurality of openings extending from the surface of the second semiconductor material toward the substrate material.Type: GrantFiled: September 2, 2010Date of Patent: April 11, 2017Assignee: Micron Technology, Inc.Inventors: Cem Basceri, Casey Kurth, Thomas Gehrke, Kevin Tetz
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Publication number: 20160372451Abstract: Solid state lights (SSLs) including a back-to-back solid state emitters (SSEs) and associated methods are disclosed herein. In various embodiments, an SSL can include a carrier substrate having a first surface and a second surface different from the first surface. First and second through substrate interconnects (TSIs) can extend from the first surface of the carrier substrate to the second surface. The SSL can further include a first and a second SSE, each having a front side and a back side opposite the front side. The back side of the first SSE faces the first surface of the carrier substrate and the first SSE is electrically coupled to the first and second TSIs. The back side of the second SSE faces the second surface of the carrier substrate and the second SSE is electrically coupled to the first and second TSIs.Type: ApplicationFiled: August 30, 2016Publication date: December 22, 2016Inventors: Cem Basceri, Casey Kurth, Kevin Tetz
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Patent number: 9443834Abstract: Solid state lights (SSLs) including a back-to-back solid state emitters (SSEs) and associated methods are disclosed herein. In various embodiments, an SSL can include a carrier substrate having a first surface and a second surface different from the first surface. First and second through substrate interconnects (TSIs) can extend from the first surface of the carrier substrate to the second surface. The SSL can further include a first and a second SSE, each having a front side and a back side opposite the front side. The back side of the first SSE faces the first surface of the carrier substrate and the first SSE is electrically coupled to the first and second TSIs. The back side of the second SSE faces the second surface of the carrier substrate and the second SSE is electrically coupled to the first and second TSIs.Type: GrantFiled: September 2, 2010Date of Patent: September 13, 2016Assignee: Micron Technology, Inc.Inventors: Cem Basceri, Casey Kurth, Kevin Tetz
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Publication number: 20160155893Abstract: Engineered substrates for semiconductor devices are disclosed herein. A device in accordance with a particular embodiment includes a transducer structure having a plurality of semiconductor materials including a radiation-emitting active region. The device further includes an engineered substrate having a first material and a second material, at least one of the first material and the second material having a coefficient of thermal expansion at least approximately matched to a coefficient of thermal expansion of at least one of the plurality of semiconductor materials. At least one of the first material and the second material is positioned to receive radiation from the active region and modify a characteristic of the light.Type: ApplicationFiled: February 5, 2016Publication date: June 2, 2016Inventors: Martin F. Schubert, Cem Basceri, Vladimir Odnoblyudov, Casey Kurth, Thomas Gehrke
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Patent number: 9293678Abstract: Solid-state lighting devices (SSLDs) including a carrier substrate with conductors and methods of manufacturing SSLDs. The conductors can provide (a) improved thermal conductivity between a solid-state light emitter (SSLE) and a package substrate and (b) improved electrical conductivity for the SSLE. In one embodiment, the conductors have higher thermal and electrical conductivities than the carrier substrate supporting the SSLE.Type: GrantFiled: July 15, 2010Date of Patent: March 22, 2016Assignee: Micron Technology, Inc.Inventors: Scott D. Schellhammer, Scott E. Sills, Casey Kurth
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Publication number: 20160072016Abstract: Solid-state lighting devices (SSLDs) including a carrier substrate with conductors and methods of manufacturing SSLDs. The conductors can provide (a) improved thermal conductivity between a solid-state light emitter (SSLE) and a package substrate and (b) improved electrical conductivity for the SSLE. In one embodiment, the conductors have higher thermal and electrical conductivities than the carrier substrate supporting the SSLE.Type: ApplicationFiled: August 12, 2015Publication date: March 10, 2016Inventors: Scott D. Schellhammer, Scott E. Sills, Casey Kurth
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Patent number: 9269858Abstract: Engineered substrates for semiconductor devices are disclosed herein. A device in accordance with a particular embodiment includes a transducer structure having a plurality of semiconductor materials including a radiation-emitting active region. The device further includes an engineered substrate having a first material and a second material, at least one of the first material and the second material having a coefficient of thermal expansion at least approximately matched to a coefficient of thermal expansion of at least one of the plurality of semiconductor materials. At least one of the first material and the second material is positioned to receive radiation from the active region and modify a characteristic of the light.Type: GrantFiled: August 31, 2011Date of Patent: February 23, 2016Assignee: Micron Technology, Inc.Inventors: Martin F. Schubert, Cem Basceri, Vladimir Odnoblyudov, Casey Kurth, Thomas Gehrke
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Publication number: 20130049043Abstract: Engineered substrates for semiconductor devices are disclosed herein. A device in accordance with a particular embodiment includes a transducer structure having a plurality of semiconductor materials including a radiation-emitting active region. The device further includes an engineered substrate having a first material and a second material, at least one of the first material and the second material having a coefficient of thermal expansion at least approximately matched to a coefficient of thermal expansion of at least one of the plurality of semiconductor materials. At least one of the first material and the second material is positioned to receive radiation from the active region and modify a characteristic of the light.Type: ApplicationFiled: August 31, 2011Publication date: February 28, 2013Applicant: MICRON TECHNOLOGY, INC.Inventors: Martin F. Schubert, Cem Basceri, Vladimir Odnoblyudov, Casey Kurth, Thomas Gehrke