Patents by Inventor Casey L. Prindivill

Casey L. Prindivill has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods of die attachment for BOC and F/C surface mount
    Patent number: 6691406
    Abstract: Methods for attaching an integrated circuit die to a substrate. Specifically, substrates which are used for BOC/COB or F/C surface mounting comprise protrusions on the surface of the substrate. The protrusions are configured to form barriers to hold an adhesive paste within the barriers. An integrated circuit die is disposed on the top of the barriers and coupled to the substrate by the adhesive paste.
    Type: Grant
    Filed: July 12, 2001
    Date of Patent: February 17, 2004
    Assignee: Micron Technology, Inc.
    Inventors: Casey L. Prindivill, Tongbi Jiang
  • Method and apparatus of die attachment for BOC and F/C surface mount
    Patent number: 6538898
    Abstract: A method and apparatus for attaching an integrated circuit die to a substrate. Specifically, substrates which are used for BOC/COB or F/C surface, mounting comprise protrusions on the surface of the substrate. The protrusions are configured to form barriers to hold an adhesive paste within the barriers. An integrated circuit die is disposed on the top of the barriers and coupled to the substrate by the adhesive paste.
    Type: Grant
    Filed: May 1, 2000
    Date of Patent: March 25, 2003
    Assignee: Micron Technology, Inc.
    Inventors: Casey L. Prindivill, Tongbi Jiang
  • Method and apparatus of die attachment for BOC and F/C surface mount
    Publication number: 20010037567
    Abstract: A method and apparatus for attaching an integrated circuit die to a substrate. Specifically, substrates which are used for BOC/COB or F/C surface mounting comprise protrusions on the surface of the substrate. The protrusions are configured to form barriers to hold an adhesive paste within the barriers. An integrated circuit die is disposed on the top of the barriers and coupled to the substrate by the adhesive paste.
    Type: Application
    Filed: July 12, 2001
    Publication date: November 8, 2001
    Inventors: Casey L. Prindivill, Tongbi Jiang