Patents by Inventor Casey Prindiville
Casey Prindiville has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20050275087Abstract: An electronic system having heat dissipating properties is provided. The electronic system may include first and second integrated circuit packages. Either or both of these packages may include a thermally conductive strip disposed proximate to the respective integrated circuit. The thermally conductive strip extends through the respective integrated circuit package and into a surrounding environment.Type: ApplicationFiled: August 5, 2005Publication date: December 15, 2005Inventor: Casey Prindiville
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Publication number: 20050269675Abstract: A technique is provided for dissipating heat from an integrated circuit within a package. A thermally conductive strip may be disposed adjacent to an integrated circuit die before packaging. The package is formed around the integrated circuit and the thermally conductive strip such that a portion of the thermally conductive strip extends through the package. Heat is conducted from the integrated circuit through the thermally conductive strip to the environment surrounding the package. A thermally conductive strip may be installed within a package by an adhesive or other mechanical means. A thermally conductive strip may be comprised of a metallic foil or other thermally conductive material.Type: ApplicationFiled: August 5, 2005Publication date: December 8, 2005Inventor: Casey Prindiville
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Patent number: 6891108Abstract: Semiconductor package support elements including cover members attached to one or more reject die sites. Also, methods for making the support elements and for making semiconductor packages using the same. Reject die sites on defective substrates of a support element are covered prior to the encapsulation process using a cover member. The cover member comprises, for example, pressure-sensitive or temperature-activated tape, reject dies, or the like. The support elements and methods of the present invention virtually eliminate bleeding or flashing during encapsulation due to the presence of reject die sites. The support elements and methods of the present invention further ensure that functional dice are not sacrificed by being attached to reject die sites, thereby decreasing manufacturing costs while increasing yield of functional semiconductor packages.Type: GrantFiled: October 4, 2001Date of Patent: May 10, 2005Assignee: Micron Technology, Inc.Inventors: Casey Prindiville, Tongbi Jiang, Bret Street
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Patent number: 6858927Abstract: Semiconductor package support elements including cover members attached to one or more reject die sites are provided. Methods for making the support elements of the present invention and for making semiconductor packages using the same are also provided. Reject die sites on defective substrates of a support element are covered prior to the encapsulation process using a cover member. The cover member comprises, for example, pressure sensitive or temperature-activated tape, reject dies, or the like. The support elements and methods of the present invention virtually eliminate bleeding or flashing during encapsulation due to the presence of reject die sites. The support elements and methods of the present invention further ensure that functional dice are not sacrificed by being attached to reject die sites, thereby decreasing manufacturing costs while increasing yield of functional semiconductor packages.Type: GrantFiled: October 4, 2001Date of Patent: February 22, 2005Assignee: Micron Technology, Inc.Inventors: Casey Prindiville, Tongbi Jiang, Bret Street
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Publication number: 20050034818Abstract: Apparatus and methods for synchronously removing coverlay film from an adhesive film and applying an adhesive strip cut from the adhesive film to cover one or more reject die sites and/or functional die sites on semiconductor package support elements are disclosed. Reject die sites on defective substrates are covered prior to encapsulation.Type: ApplicationFiled: March 11, 2004Publication date: February 17, 2005Inventor: Casey Prindiville
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Patent number: 6833510Abstract: Semiconductor package support elements including cover members attached to one or more reject die sites are provided. Methods for making the support elements of the present invention and for making semiconductor packages using the same are also provided. Reject die sites on defective substrates of a support element are covered prior to the encapsulation process using a cover member. The cover member comprises, for example, pressure-sensitive or temperature-activated tape, reject dies, or the like. The support elements and methods of the present invention virtually eliminate bleeding or flashing during encapsulation due to the presence of reject die sites. The support elements and methods of the present invention further ensure that functional dice are not sacrificed by being attached to reject die sites, thereby decreasing manufacturing costs while increasing yield of functional semiconductor packages.Type: GrantFiled: October 4, 2001Date of Patent: December 21, 2004Assignee: Micron Technology, Inc.Inventors: Casey Prindiville, Tongbi Jiang, Bret Street
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Patent number: 6779258Abstract: Semiconductor package support elements including cover members attached to one or more reject die sites are provided. Methods for making the support elements of the present invention and for making semiconductor packages using the same are also provided. Reject die sites on defective substrates of a support element are covered prior to the encapsulation process using a cover member. The cover member comprises, for example, pressure-sensitive or temperature-activated tape, reject dies, or the like. The support elements and methods of the present invention virtually eliminate bleeding or flashing during encapsulation due to the presence of reject die sites. The support elements and methods of the present invention further ensure that functional dice are not sacrificed by being attached to reject die sites, thereby decreasing manufacturing costs while increasing yield of functional semiconductor packages.Type: GrantFiled: October 4, 2001Date of Patent: August 24, 2004Assignee: Micron Technology, Inc.Inventors: Casey Prindiville, Tongbi Jiang, Bret Street
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Patent number: 6749711Abstract: Apparatus and methods for synchronously removing coverlay film from an adhesive film and applying an adhesive strip cut from the adhesive film to cover one or more reject die sites and/or functional die sites on semiconductor package support elements are disclosed. Reject die sites on defective substrates are covered prior to encapsulation.Type: GrantFiled: February 5, 2003Date of Patent: June 15, 2004Assignee: Micron Technology, Inc.Inventor: Casey Prindiville
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Publication number: 20030127182Abstract: Apparatus and methods for synchronously removing coverlay film from an adhesive film and applying an adhesive strip cut from the adhesive film to cover one or more reject die sites and/or functional die sites on semiconductor package support elements are disclosed. Reject die sites on defective substrates are covered prior to encapsulation.Type: ApplicationFiled: February 5, 2003Publication date: July 10, 2003Applicant: Micron Technology, Inc.Inventor: Casey Prindiville
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Patent number: 6548764Abstract: Semiconductor package support elements including cover members attached to one or more reject die sites are provided. Methods for making the support elements of the present invention and for making semiconductor packages using the same are also provided. Reject die sites on defective substrates of a support element are covered prior to the encapsulation process using a cover member. The cover member comprises, for example, pressure-sensitive or temperature-activated tape, reject dies, or the like. The support elements and methods of the present invention virtually eliminate bleeding or flashing during encapsulation due to the presence of reject die sites. The support elements and methods of the present invention further ensure that functional dice are not sacrificed by being attached to reject die sites, thereby decreasing manufacturing costs while increasing yield of functional semiconductor packages.Type: GrantFiled: June 7, 2000Date of Patent: April 15, 2003Assignee: Micron Technology, Inc.Inventors: Casey Prindiville, Tongbi Jiang, Bret Street
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Patent number: 6543510Abstract: Apparatus and methods for synchronously removing coverlay film from an adhesive film and applying an adhesive strip cut from the adhesive film to cover one or more reject die sites and/or functional die sites on semiconductor package support elements are disclosed. Reject die sites on defective substrates are covered prior to encapsulation.Type: GrantFiled: June 7, 2000Date of Patent: April 8, 2003Assignee: Micron Technology, Inc.Inventor: Casey Prindiville
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Publication number: 20020043401Abstract: Semiconductor package support elements including cover members attached to one or more reject die sites are provided. Methods for making the support elements of the present invention and for making semiconductor packages using the same are also provided. Reject die sites on defective substrates of a support element are covered prior to the encapsulation process using a cover member. The cover member comprises, for example, pressure-sensitive or temperature-activated tape, reject dies, or the like. The support elements and methods of the present invention virtually eliminate bleeding or flashing during encapsulation due to the presence of reject die sites. The support elements and methods of the present invention further ensure that functional dice are not sacrificed by being attached to reject die sites, thereby decreasing manufacturing costs while increasing yield of functional semiconductor packages.Type: ApplicationFiled: October 4, 2001Publication date: April 18, 2002Applicant: Micron Technology, Inc.Inventors: Casey Prindiville, Tongbi Jiang, Bret Street
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Publication number: 20020030575Abstract: Semiconductor package support elements including cover members attached to one or more reject die sites are provided. Methods for making the support elements of the present invention and for making semiconductor packages using the same are also provided. Reject die sites on defective substrates of a support element are covered prior to the encapsulation process using a cover member. The cover member comprises, for example, pressure-sensitive or temperature-activated tape, reject dies, or the like. The support elements and methods of the present invention virtually eliminate bleeding or flashing during encapsulation due to the presence of reject die sites. The support elements and methods of the present invention further ensure that functional dice are not sacrificed by being attached to reject die sites, thereby decreasing manufacturing costs while increasing yield of functional semiconductor packages.Type: ApplicationFiled: October 4, 2001Publication date: March 14, 2002Applicant: Micron Technology, Inc.Inventors: Casey Prindiville, Tongbi Jiang, Bret Street
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Publication number: 20020020902Abstract: Semiconductor package support elements including cover members attached to one or more reject die sites are provided. Methods for making the support elements of the present invention and for making semiconductor packages using the same are also provided. Reject die sites on defective substrates of a support element are covered prior to the encapsulation process using a cover member. The cover member comprises, for example, pressure-sensitive or temperature-activated tape, reject dies, or the like. The support elements and methods of the present invention virtually eliminate bleeding or flashing during encapsulation due to the presence of reject die sites. The support elements and methods of the present invention further ensure that functional dice are not sacrificed by being attached to reject die sites, thereby decreasing manufacturing costs while increasing yield of functional semiconductor packages.Type: ApplicationFiled: October 4, 2001Publication date: February 21, 2002Applicant: Micron Technology, Inc.Inventors: Casey Prindiville, Tongbi Jiang, Bret Street
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Publication number: 20020020908Abstract: Semiconductor package support elements including cover members attached to one or more reject die sites are provided. Methods for making the support elements of the present invention and for making semiconductor packages using the same are also provided. Reject die sites on defective substrates of a support element are covered prior to the encapsulation process using a cover member. The cover member comprises, for example, pressure sensitive or temperature-activated tape, reject dies, or the like. The support elements and methods of the present invention virtually eliminate bleeding or flashing during encapsulation due to the presence of reject die sites. The support elements and methods of the present invention further ensure that functional dice are not sacrificed by being attached to reject die sites, thereby decreasing manufacturing costs while increasing yield of functional semiconductor packages.Type: ApplicationFiled: October 4, 2001Publication date: February 21, 2002Applicant: Micron Technology, Inc.Inventors: Casey Prindiville, Tongbi Jiang, Bret Street