Abstract: Techniques for reconfigurable heat sinks are disclosed. In one embodiment, a compute system includes a heat sink includes a core fin assembly with two removable lateral fin assemblies. The lateral fin assemblies may be above one or more components of the compute system, such as one or more memory modules. With the lateral fin assemblies in place, the cooling capacity of the heat sink is increased, but the more memory modules may be difficult or impossible to service. With the lateral fin assemblies removed, the memory modules can be serviced (e.g., replaced). In another embodiment, a lateral fin assembly of a heat sink is attached to a heat pipe. The lateral fin assembly can rotate relative to the heat pipe, allowing the lateral fin assembly to fit within a 2U form factor in one configuration and allow access to components under the lateral fin assembly in another configuration.

Abstract: Two liquid cooling mechanisms are provided for cooling integrated circuit components immersed in an open bath immersion tank. In the first mechanism, heat generated by high-thermal design power (TDP) components is absorbed by a working fluid passing through cold plates coupled to the high-TDP components. The cold plates are part of direct liquid cooling loops attached to supply and return manifolds fluidly connected to a cooling distribution unit. In the second mechanism, integrated circuit components not coupled to any of the direct liquid cooling loops dissipate heat directly to the immersion fluid. In some embodiments, the tank is a closed bath immersion tank and heat captured by the working fluid is reclaimed and converted to electricity. Working fluid flow rate can be adjusted based on integrated circuit component power consumption levels to achieve a desired working fluid temperature as it enters an energy reclamation unit.