Abstract: The present disclosure is directed to systems and methods of improving the thermal performance of processor-based devices. Such thermal performance improvement may include limiting the degree of tilt experienced by a semiconductor device as a thermal solution coupled to the semiconductor device is tightened to the substrate. Such thermal performance improvements may include increasing the available heat transfer area associated with a particular heat producing semiconductor device. Such thermal performance improvements may include thermally coupling one or more cool blocks thermally coupled to one or more remote heat-producing devices to a central cool block that may be cooled using a cooling medium or coupled to a central heat-producing semiconductor device.

Abstract: An apparatus is described. The apparatus includes a housing including a base and sidewalls. The housing is to support a circuit board. The apparatus also includes a heat sink to be supported by the housing independent of the circuit board. The heat sink is to be thermally coupled to a semiconductor package attached to the circuit board. The heat sink is to be closer to the base of the housing than the circuit board is to be to the base of the housing.

Abstract: An apparatus is described. The apparatus includes an electronic system. The electronic system includes a chassis. The electronic system includes a semiconductor chip cooling component that is rigidly fixed to the chassis. The electronic system includes a packaged semiconductor chip having a lid that is contact with the semiconductor chip cooling component. The electronic system includes an electronic circuit board. The packaged semiconductor chip is electro-mechanically attached to the electronic circuit board.

Abstract: Methods and apparatus are disclosed to cool hardware. An example apparatus to cool a hardware component includes a first substrate; a second substrate couplable to a chassis, the second substrate formed of a metal; and a plurality of malleable fins coupled between the first and second substrates, the malleable fins formed of a thermally conductive material.

Abstract: An apparatus is described. The apparatus includes a ball grid array (BGA) chip package cooling assembly includes a back plate and a bolster plate. The bolster plate has frame arms. The BGA chip package is to be placed in a window formed by the frame arms and soldered to a region of a printed circuit board. The frame arms surround the region. The printed circuit board is to be subjected to a compressive force between the back plate and the bolster plate.

Abstract: Embodiments are directed towards apparatuses, methods, and systems for a connector having a housing body to couple a dual in-line memory module (DIMM) to a printed circuit board (PCB). In embodiments, the housing body includes first and second opposing ends of the connector and a first and a second latch coupled at the respective first and second opposing ends of the connector to engage the DIMM. In embodiments, the first and the second opposing ends have respective first and second heights relative to a height of the housing body to allow the DIMM to be inserted or removed at an angle when disengaged from the first and second latch. In embodiments, one or more of the latches are removably coupled to the connector and/or can be rotated into a lay-flat position to allow the DIMM to be removed at an angle. Additional embodiments may be described and claimed.

Abstract: An apparatus is described. The apparatus includes a module to be inserted into an electronic system. The module includes a first heat exchanger at one end of the module and second heat exchanger at another end of the module. The module also includes a first vapor chamber that runs along respective integrated heat spreaders of semiconductor chips disposed on a first side of the module and a second vapor chamber that runs along respective integrated heat spreaders of semiconductor chips disposed on a second side of the module. The first heat exchanger is in thermal contact with at least one of the first and second vapor chambers, and, the second heat exchanger is in thermal contact with at least one of the first and second vapor chambers.

Abstract: The present disclosure is directed to systems and methods of improving the thermal performance of processor-based devices. Such thermal performance improvement may include limiting the degree of tilt experienced by a semiconductor device as a thermal solution coupled to the semiconductor device is tightened to the substrate. Such thermal performance improvements may include increasing the available heat transfer area associated with a particular heat producing semiconductor device. Such thermal performance improvements may include thermally coupling one or more cool blocks thermally coupled to one or more remote heat-producing devices to a central cool block that may be cooled using a cooling medium or coupled to a central heat-producing semiconductor device.

Abstract: Technologies for managing hot spots in a compute device with use of a vortex tube are disclosed. Cold air from one or more vortex tubes can be routed to hot spots of one or more compute devices, providing effective spot cooling. This approach may allow for cooling of components that might otherwise be difficult to cool, such as components where would be difficult or impossible to cool with a heat sink. This approach may also be effective in cooling components that are downstream of a heat sink and would otherwise only be cooled by air that was already heated by the heat sink.

Abstract: An apparatus is described. The apparatus includes a printed circuit board (PCB) dual in-line memory module (DIMM) connector having ejectors. The ejectors have a small enough vertical profile to permit unbent liquid cooling conduits to run across the DIMM's semiconductor chips.

Abstract: An apparatus is described. The apparatus includes an electronic system. The electronic system includes a chassis. The electronic system includes a semiconductor chip cooling component that is rigidly fixed to the chassis. The electronic system includes a packaged semiconductor chip having a lid that is contact with the semiconductor chip cooling component. The electronic system includes an electronic circuit board. The packaged semiconductor chip is electro-mechanically attached to the electronic circuit board.

Abstract: The present disclosure is directed to systems and methods of improving the thermal performance of processor-based devices. Such thermal performance improvement may include limiting the degree of tilt experienced by a semiconductor device as a thermal solution coupled to the semiconductor device is tightened to the substrate. Such thermal performance improvements may include increasing the available heat transfer area associated with a particular heat producing semiconductor device. Such thermal performance improvements may include thermally coupling one or more cool blocks thermally coupled to one or more remote heat-producing devices to a central cool block that may be cooled using a cooling medium or coupled to a central heat-producing semiconductor device.

Abstract: Embodiments are directed towards apparatuses, methods, and systems for a connector having a housing body to couple a dual in-line memory module (DIMM) to a printed circuit board (PCB). In embodiments, the housing body includes first and second opposing ends of the connector and a first and a second latch coupled at the respective first and second opposing ends of the connector to engage the DIMM. In embodiments, the first and the second opposing ends have respective first and second heights relative to a height of the housing body to allow the DIMM to be inserted or removed at an angle when disengaged from the first and second latch. In embodiments, one or more of the latches are removably coupled to the connector and/or can be rotated into a lay-flat position to allow the DIMM to be removed at an angle. Additional embodiments may be described and claimed.

Abstract: Embodiments herein relate to hydraulic bladders to provide a force against an integrated circuit package to be located between the hydraulic bladder and a system board. In various embodiments, a hydraulic force generator may include a block to be coupled with a system board and a hydraulic bladder to be located between the block and the system board, where the hydraulic bladder, in response to pressurization, is to provide a force against an integrated circuit package to be located between the hydraulic bladder and the system board. Other embodiments may be described and/or claimed.

Abstract: Technologies for managing hot spots in a compute device with use of a vortex tube are disclosed. Cold air from one or more vortex tubes can be routed to hot spots of one or more compute devices, providing effective spot cooling. This approach may allow for cooling of components that might otherwise be difficult to cool, such as components where would be difficult or impossible to cool with a heat sink. This approach may also be effective in cooling components that are downstream of a heat sink and would otherwise only be cooled by air that was already heated by the heat sink.

Abstract: Embodiments herein relate to hydraulic bladders to provide a force against an integrated circuit package to be located between the hydraulic bladder and a system board. In various embodiments, a hydraulic force generator may include a block to be coupled with a system board and a hydraulic bladder to be located between the block and the system board, where the hydraulic bladder, in response to pressurization, is to provide a force against an integrated circuit package to be located between the hydraulic bladder and the system board. Other embodiments may be described and/or claimed.

Abstract: A portion of a chassis comprised of a material forming a portion of the exterior of the chassis and a high-density flexible material adjacent an inner surface of the portion of the chassis with air holes formed contiguously through both the portion of the chassis and the high-density flexible material.

Abstract: A portion of a chassis comprised of a material forming a portion of the exterior of the chassis and a high-density flexible material adjacent an inner surface of the portion of the chassis with air holes formed contiguously through both the portion of the chassis and the high-density flexible material.

Abstract: A cooling fan system has a fan assembly that is removably housed in a chassis. The fan assembly receives electrical power, and the fan blades rotate when housed inside the chassis. As the fan assembly is removed from an opening in the chassis, the power to the fan assembly is disconnected, but the fan blades may continue to rotate. A mechanical stopper, such as a row of bristles that extends into the opening in the chassis, interferes with the rotation of the fan blades as the fan assembly is removed from the chassis. The mechanical stopper stops rotation of the fan blades, thereby preventing harm to the user removing the fan assembly. After the fan assembly is completely removed from the chassis, a spring-loaded door closes the opening in the chassis further protecting the user from contacting adjacent spinning fan blades or hazardous energy sources within the chassis.