Abstract: A superconducting circuit comprises a first and second magnetic-flux-tunable elements. Each of these has a respective flux-sensitive part. First and second current-driven superconductive on-chip flux bias lines are provided. Each of these passes adjacent to the flux-sensitive part of the respective magnetic-flux-tunable element. A first plurality of superconductive stray current paths exists adjacent to the first magnetic-flux-tunable element. A second plurality of superconductive stray current paths exist adjacent to the second magnetic-flux-tunable element. The superconductive stray current paths distribute stray currents originating from the flux line of the other magnetic-flux-tunable element into a respective plurality of stray currents around the respective magnetic-flux-tunable element. This way the stray currents are kept from changing the electric characteristics of the respective magnetic-flux-tunable element.

Abstract: A superconducting circuit comprises a first and second magnetic-flux-tunable elements. Each of these has a respective flux-sensitive part. First and second current-driven superconductive on-chip flux bias lines are provided. Each of these passes adjacent to the flux-sensitive part of the respective magnetic-flux-tunable element. A first plurality of superconductive stray current paths exists adjacent to the first magnetic-flux-tunable element. A second plurality of superconductive stray current paths exist adjacent to the second magnetic-flux-tunable element. The superconductive stray current paths distribute stray currents originating from the flux line of the other magnetic-flux-tunable element into a respective plurality of stray currents around the respective magnetic-flux-tunable element. This way the stray currents are kept from changing the electric characteristics of the respective magnetic-flux-tunable element.

Abstract: A three-dimensional superconducting qubit and a method for manufacturing the same are disclosed. In an example, a three-dimensional superconducting qubit comprises a structural base comprising one or more insulating materials, and superconductive patterns on surfaces of the structural base. The superconductive patterns form at least a capacitive part and an inductive part of the three-dimensional superconducting qubit. A first surface of the surfaces of the structural base defines a first plane and a second surface of the surfaces of the structural base defines a second plane, the second plane being oriented differently than the first plane. At least one superconductive pattern of the superconductive patterns extends from the first surface to the second surface.

Abstract: An airbridge implements connections on a superconducting chip. It comprises a strip of superconductive material between a first superconductive area and a second superconductive area. A first end of said strip comprises a first planar end portion attached to and parallel with said first superconductive area, and a second end of said strip comprises a respective second planar end portion. A middle portion is located between said first and second planar end portions, forming a bend away from a plane defined by the surfaces of the first and second superconductive areas. First and second separation lines separate the end portions from the middle portion. At least one of said first and second separation lines is directed otherwise than transversally across said strip.

Abstract: The invention relates to a method for forming flip chip bumps using electroplating. The method allows the formation of flip chip bumps in a way that is compatible with already-formed sensitive electronic components, such as Josephson junctions, which may be used in quantum processing units. The invention also relates to a product and a flip chip package in which flip chip bumps are formed with the disclosed method.

Abstract: Superconducting through substrate vias (STSVs) are disclosed. The STSVs provide superconducting interconnections between opposite faces of a substrate. In an example, a method of forming STSVs includes etching openings that extend from a first side of a substrate partially through the substrate towards a second side of the substrate. The method also includes depositing a seed layer over the first side of the substrate and interior surfaces of the openings in the substrate. The method further includes forming a resist or hardmask on the first side of the substrate above the seed layer, such that the resist or hardmask comprises openings aligned with the etched openings in the substrate. The etched openings in the substrate are filled with a superconducting filler material. The substrate is thinned by removing material from the second side of the substrate until the deposited seed layer is exposed on the second side of the substrate.

Abstract: A three-dimensional superconducting qubit and a method for manufacturing the same are disclosed. In an example, a three-dimensional superconducting qubit comprises a structural base comprising one or more insulating materials, and superconductive patterns on surfaces of the structural base. The superconductive patterns form at least a capacitive part and an inductive part of the three-dimensional superconducting qubit. A first surface of the surfaces of the structural base defines a first plane and a second surface of the surfaces of the structural base defines a second plane, the second plane being oriented differently than the first plane. At least one superconductive pattern of the superconductive patterns extends from the first surface to the second surface.

Abstract: A tunable coupler for making a controllable coupling to at least a first qubit is disclosed. The tunable coupler includes a first constant coupling element and a tunable coupling element. The first constant coupling element forms a non-galvanic coupling interface to at least the first qubit at a first extremity that is distant from the tunable coupling element. The tunable coupling element is located adjacent to a non-galvanic coupling interface formed as an interface to a circuit element at a second extremity thereof.

Abstract: An airbridge implements connections on a superconducting chip. It comprises a strip of superconductive material between a first superconductive area and a second superconductive area. A first end of said strip comprises a first planar end portion attached to and parallel with said first superconductive area, and a second end of said strip comprises a respective second planar end portion. A middle portion is located between said first and second planar end portions, forming a bend away from a plane defined by the surfaces of the first and second superconductive areas. First and second separation lines separate the end portions from the middle portion. At least one of said first and second separation lines is directed otherwise than transversally across said strip.