Patents by Inventor Cassady Sparks Roop

Cassady Sparks Roop has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12042986
    Abstract: The present disclosure is drawn to 3-dimensional printed parts that can include a conductive composite portion and an insulating portion. The conductive composite portion can include a matrix of fused thermoplastic polymer particles interlocked with a matrix of sintered elemental transition metal particles. The insulating portion can include a matrix of fused thermoplastic polymer particles that are continuous with the matrix of fused thermoplastic polymer particles in the conductive composite portion. The insulating portion can be substantially free of sintered elemental transition metal particles and can include transition metal oxide bronze particles.
    Type: Grant
    Filed: August 19, 2022
    Date of Patent: July 23, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Sterling Chaffins, Cassady Sparks Roop, Kevin P. Dekam, Vladek Kasperchik, Ali Emamjomeh, Johnathon Holroyd, Stephen G. Rudisill, Alexey S. Kabalnov
  • Patent number: 12011874
    Abstract: A strain sensor can include a resistor, a first electrical contact at a first end of the resistor, and a second electrical contact at a second end of the resistor. The resistor can be formed of a matrix of sintered elemental transition metal particles interlocked with a matrix of fused thermoplastic polymer particles.
    Type: Grant
    Filed: July 15, 2021
    Date of Patent: June 18, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Sterling Chaffins, Kevin P. Dekam, Cassady Sparks Roop
  • Publication number: 20230347586
    Abstract: The present disclosure is drawn to 3D printing kits, multi-fluid kits for 3D printing, and methods of making 3D printed articles. In one example, a 3D printing kit can include a powder bed material, a fusible fluid, and a magnetic fluid. The powder bed material can include polymer particles. The fusible fluid can include water and a radiation absorber. The fusible fluid can be to selectively apply to the powder bed material. The magnetic fluid can include magnetic particles, and the magnetic fluid can be to selectively apply to the powder bed material.
    Type: Application
    Filed: July 7, 2023
    Publication date: November 2, 2023
    Inventors: Kevin P. DeKam, Sterling Chaffins, Cassady Sparks Roop
  • Patent number: 11712845
    Abstract: The present disclosure is drawn to 3D printing kits, multi-fluid kits for 3D printing, and methods of making 3D printed articles. In one example, a 3D printing kit can include a powder bed material, a fusible fluid, and a magnetic fluid. The powder bed material can include polymer particles. The fusible fluid can include water and a radiation absorber. The fusible fluid can be to selectively apply to the powder bed material. The magnetic fluid can include magnetic particles, and the magnetic fluid can be to selectively apply to the powder bed material.
    Type: Grant
    Filed: October 16, 2018
    Date of Patent: August 1, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Kevin P. DeKam, Sterling Chaffins, Cassady Sparks Roop
  • Publication number: 20220388239
    Abstract: The present disclosure is drawn to 3-dimensional printed parts that can include a conductive composite portion and an insulating portion. The conductive composite portion can include a matrix of fused thermoplastic polymer particles interlocked with a matrix of sintered elemental transition metal particles. The insulating portion can include a matrix of fused thermoplastic polymer particles that are continuous with the matrix of fused thermoplastic polymer particles in the conductive composite portion. The insulating portion can be substantially free of sintered elemental transition metal particles and can include transition metal oxide bronze particles.
    Type: Application
    Filed: August 19, 2022
    Publication date: December 8, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Sterling CHAFFINS, Cassady Sparks ROOP, Kevin P. DEKAM, Vladek KASPERCHIK, Ali EMAMJOMEH, Johnathon HOLROYD, Stephen G. RUDISILL, Alexey S. KABALNOV
  • Patent number: 11458675
    Abstract: The present disclosure is drawn to material sets for 3-dimensional printing. The material set can include a thermoplastic polymer powder having an average particle size from 20 ?m to 200 ?m, a conductive fusing agent composition including a transition metal, and nonconductive fusing agent composition. The nonconductive fusing agent composition can include transition metal oxide bronze particles.
    Type: Grant
    Filed: October 25, 2016
    Date of Patent: October 4, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Sterling Chaffins, Cassady Sparks Roop, Kevin P DeKam, Vladek Kasperchik, Ali Emamjomeh, Johnathon Holroyd, Stephen G Rudisill, Alexey S Kabalnov
  • Publication number: 20210362408
    Abstract: The present disclosure is drawn to 3D printing kits, multi-fluid kits for 3D printing, and methods of making 3D printed articles. In one example, a 3D printing kit can include a powder bed material, a fusible fluid, and a magnetic fluid. The powder bed material can include polymer particles. The fusible fluid can include water and a radiation absorber. The fusible fluid can be to selectively apply to the powder bed material. The magnetic fluid can include magnetic particles, and the magnetic fluid can be to selectively apply to the powder bed material.
    Type: Application
    Filed: October 16, 2018
    Publication date: November 25, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Kevin P. DeKam, Sterling Chaffins, Cassady Sparks Roop
  • Publication number: 20210339466
    Abstract: A strain sensor can include a resistor, a first electrical contact at a first end of the resistor, and a second electrical contact at a second end of the resistor. The resistor can be formed of a matrix of sintered elemental transition metal particles interlocked with a matrix of fused thermoplastic polymer particles.
    Type: Application
    Filed: July 15, 2021
    Publication date: November 4, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Sterling CHAFFINS, Kevin P. DEKAM, Cassady Sparks ROOP
  • Patent number: 11090862
    Abstract: A strain sensor can include a resistor, a first electrical contact at a first end of the resistor, and a second electrical contact at a second end of the resistor. The resistor can be formed of a matrix of sintered elemental transition metal particles interlocked with a matrix of fused thermoplastic polymer particles.
    Type: Grant
    Filed: April 15, 2016
    Date of Patent: August 17, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Sterling Chaffins, Kevin P. DeKam, Cassady Sparks Roop
  • Patent number: 11064572
    Abstract: According to an example, a three-dimensional (3D) printed heater may include a part body formed of fused thermoplastic polymer particles and an electrically resistive element formed of a matrix of conductive particles interspersed between a matrix of thermoplastic polymer particles. The conductive particles and the thermoplastic polymer particles may be provided at respective densities to cause the electrically resistive element to have a predetermined resistance level. The 3D printed heater may also include electrical contacts connected to the electrically resistive element, in which a current is to be applied through the electrically resistive element via the electrical contacts to cause the electrically resistive element to generate a predefined level of heat.
    Type: Grant
    Filed: June 17, 2016
    Date of Patent: July 13, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Sterling Chaffins, Cassady Sparks Roop, Kevin P. DeKam
  • Publication number: 20190240898
    Abstract: The present disclosure is drawn to material sets for 3-dimensional printing. The material set can include a thermoplastic polymer powder having an average particle size from 20 ?m to 200 ?m, a conductive fusing agent composition including a transition metal, and nonconductive fusing agent composition. The nonconductive fusing agent composition can include transition metal oxide bronze particles.
    Type: Application
    Filed: October 25, 2016
    Publication date: August 8, 2019
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Sterling Chaffins, Cassady Sparks Roop, Kevin P DeKam, Vladek Kasperchik, Ali Emamjomeh, Johnathon Holroyd, Stephen G Rudisill, Alexey S Kabalnov
  • Publication number: 20190152137
    Abstract: A strain sensor can include a resistor, a first electrical contact at a first end of the resistor, and a second electrical contact at a second end of the resistor. The resistor can be formed of a matrix of sintered elemental transition metal particles interlocked with a matrix of fused thermoplastic polymer particles.
    Type: Application
    Filed: April 15, 2016
    Publication date: May 23, 2019
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Sterling Chaffins, Kevin P. DeKam, Cassady Sparks Roop
  • Publication number: 20190037646
    Abstract: According to an example, a three-dimensional (3D) printed heater may include a part body formed of fused thermoplastic polymer particles and an electrically resistive element formed of a matrix of conductive particles interspersed between a matrix of thermoplastic polymer particles. The conductive particles and the thermoplastic polymer particles may be provided at respective densities to cause the electrically resistive element to have a predetermined resistance level. The 3D printed heater may also include electrical contacts connected to the electrically resistive element, in which a current is to be applied through the electrically resistive element via the electrical contacts to cause the electrically resistive element to generate a predefined level of heat.
    Type: Application
    Filed: June 17, 2016
    Publication date: January 31, 2019
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Sterling Chaffins, Cassady Sparks Roop, Kevin P. DeKam