Abstract: A lithographic apparatus operable in a substrate exposing configuration to expose a substrate with a pattern of radiation and a radiation beam inspection configuration in which the pattern of radiation that would be exposed on the substrate if the lithographic apparatus was in the substrate exposing configuration is inspected by a radiation beam inspection device. In the radiation beam inspecting configuration, the operation of the lithographic apparatus is modified in order to minimize the difference between the pattern of radiation exposed on the substrate and the required pattern of radiation to be exposed on the substrate.

Abstract: A lithographic method to enhance image resolution in a lithographic cluster using multiple projections and a lithographic cluster used to project multiple patterns to form images that are combined to form an image having enhanced resolution.

Abstract: A method, computer program product, and apparatus configured to improve attribute uniformity of a substrate is disclosed. In an embodiment, the method involves calculating corrective data based on measured values of an attribute of a substrate processed by a lithographic exposure apparatus, the corrective data configured to at least partially correct non-uniformity of the values of the substrate attribute by controlling the temperature generated by a zone of a thermal plate used to heat or cool the substrate, and making the corrective data available to the thermal plate.

Abstract: A lithographic method to enhance image resolution in a lithographic cluster using multiple projections and a lithographic cluster used to project multiple patterns to form images that are combined to form a patterned image having enhanced resolution.

Abstract: A lithographic method to enhance image resolution in a lithographic cluster using multiple projections and a lithographic cluster used to project multiple patterns to form images that are combined to form an image having enhanced resolution.

Abstract: A lithographic apparatus includes a radiation system that provides a beam of radiation, and a support structure that supports a patterning structure. The patterning structure is configured to pattern the beam of radiation according to a desired pattern. The apparatus also includes a substrate support that supports a substrate, and a projection system that projects the patterned beam onto a target portion of the substrate. The projection system includes an optical element that has a beam exit area through each of which the patterned beam passes. The apparatus further includes a fluid cleaning system that cleans a fluid to be introduced into a region in between the optical element and the substrate. The fluid cleaning system includes a fluid inlet, a fluid outlet, and a cleaning zone disposed between the inlet and outlet. The cleaning zone includes a nucleated surface provided with a plurality of nucleation sites.

Abstract: A lithographic apparatus is disclosed. The apparatus includes a radiation system that provides a beam of radiation, and a support structure that supports a patterning structure. The patterning structure is configured to pattern the beam of radiation according to a desired pattern. The apparatus also includes a substrate support that supports a substrate, and a projection system that projects the patterned beam onto a target portion of the substrate. The projection system includes an optical element that has a beam entry area and an optical element that has a beam exit area through each of which the patterned beam passes. The apparatus further includes a nucleated surface that is associated with the projection system on which a plurality of nucleation sites are provided. The surface is disposed away from at least one of the beam entry area and the beam exit area.

Abstract: A lithographic apparatus is provided with a charged object on a projection system of the lithographic apparatus, a substrate table of the lithographic apparatus, or both that is configured to have an electric charge to attract particles thereto.

Abstract: A lithographic apparatus is disclosed. The apparatus includes a radiation system that provides a beam of radiation, and a support structure that supports a patterning structure. The patterning structure is configured to pattern the beam of radiation according to a desired pattern. The apparatus also includes a substrate support that supports a substrate, and a projection system that projects the patterned beam onto a target portion of the substrate. The projection system includes an optical element that has a beam entry area and an optical element that has a beam exit area through each of which the patterned beam passes. The apparatus further includes a nucleated surface that is associated with the projection system on which a plurality of nucleation sites are provided. The surface is disposed away from at least one of the beam entry area and the beam exit area.

Abstract: A system, apparatus, and method for thermally controlling lithographic chemical processes is disclosed herein. The thermal control system includes a multi-zone thermal sensing unit containing a plurality of thermal sensor elements. These thermal elements are configured to detect the temperature of a plurality of pre-defined zones on the substrates. The system also includes a multi-zone thermal adjustment unit that contains a plurality of thermal coupler elements, which are configured to adjust the temperature of the pre-defined zones. The system further includes a thermal controller unit, operatively and communicatively coupled to the multi-zone thermal sensing unit and the multi-zone thermal adjustment unit.