Abstract: A process for making an encapsulated metal oxide varistor package comprises pressing the varistor powder mixture into a disc, sintering the pressed disc, followed by slow cooling to room temperature.The sintered disc is acid etched and a fritted-silver electrode applied on each side of the disc or in the alternative an aluminum coating is arc sprayed on each side of the disk followed by an arc sprayed copper coating on top of the aluminum coating. The fritted-silver electrode coating is heated to 660.degree. C. and slow cooled to room temperature. Sn-coated copper leads are soldered on the electroded disc of either electrode process and the assembly is encapsulated in resilient epoxy resin to form the encapsulated metal oxide varistor package.