Patents by Inventor Cathal Wilson

Cathal Wilson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11967541
    Abstract: A liquid cooled thermal heat sink is provided. A plurality of jet orifices provide an exit for pressurised liquid to exit a plenum chamber and impinge on a thermal surface whereby they effect a cooling of the thermal surface, the heated liquid being transferred through an exit channel to dissipate heat away from the thermal surface.
    Type: Grant
    Filed: July 31, 2019
    Date of Patent: April 23, 2024
    Assignee: The Provost, Fellows, Foundation Scholars and the other members of Board, of the College of the Holy and Undivided Trinity of Queen Elizabeth, Near Dublin
    Inventors: Anthony Robinson, Cathal Wilson, Leo Celdran, Nicolas Baudin
  • Publication number: 20230328920
    Abstract: A modular liquid-cooled thermal heat sink device configured to thermally engage with a thermal substrate. The device comprises a housing assembly having a body defining a volume, the housing assembly comprising a thermal cooling plate configured to be in thermal contact with the thermal substrate, a fluid inlet and a fluid outlet, the housing assembly being configured to facilitate fluid circulation within the body to effect an operative cooling of the thermal substrate through the thermal cooling plate, the body comprising a plurality of first engaging features spaced about a perimeter of the body.
    Type: Application
    Filed: November 24, 2021
    Publication date: October 12, 2023
    Inventors: Anthony Robinson, Cathal Wilson, Kenneth O'Mahony
  • Publication number: 20230254995
    Abstract: A cooling device for cooling electronic components comprising a primary electronic component, and one or more secondary electronic components of a circuit board is provided. The cooling device comprises a first cooling component. The first cooling component comprises a first cooling member configured to contact a surface of the primary electronic component. The first cooling member is configured to be in fluid communication with a fluid to effect an operative convection cooling of the surface of the primary electronic component. The cooling device further comprises a second cooling component. The second cooling component comprises a second cooling member configured to contact a respective thermal surface of the one or more secondary electronic components to effect an operative conduction cooling of the one or more secondary electronic components. The second cooling member is thermally coupled to the first cooling member.
    Type: Application
    Filed: July 7, 2021
    Publication date: August 10, 2023
    Inventors: Anthony Robinson, Cathal Wilson, Kenneth O'Mahony
  • Publication number: 20210320050
    Abstract: A liquid cooled thermal heat sink is provided. A plurality of jet orifices provide an exit for pressurised liquid to exit a plenum chamber and impinge on a thermal surface whereby they effect a cooling of the thermal surface, the heated liquid being transferred through an exit channel to dissipate heat away from the thermal surface.
    Type: Application
    Filed: July 31, 2019
    Publication date: October 14, 2021
    Inventors: Anthony Robinson, Cathal Wilson, Leo Celdran, Nicolas Baudin