Abstract: A process for manufacturing a sensor including at least two electrodes, including providing a flexible dielectric substrate having a layer of electrically conductive material on at least one of its sides. The electrodes, conductive connecting tracks and a common current supply track are etched in the layer of electrically conductive material. The process further includes electrodepositing one or more layers on the two electrodes and a step of selectively depositing, electrochemically, on at least one electrode, at least one layer of a material different from the one or more materials already deposited on another electrode.

Abstract: The invention relates to an electrical circuit, for example of the printed circuit type, for producing a module intended to be integrated into a chip card. This module has electrical contact—or connector—areas for the connection and communication of the chip to and with a read/write system. In order to give them a different colour from the gilded or silvered ones generally used, these electrical contact areas are at least partially covered with a surface layer comprising a compound of XpOqNrCs type, in which X may be Hf, Ta, Zr, Nb, Mo, Cr, V, Ti or Sc, with p, q>0 and r?0 and/or s?0. The invention also relates to a method for manufacturing such an electrical circuit.