Abstract: Curable pressure sensitive adhesive tapes comprise: a) a pressure sensitive adhesive polymer; b) particles of encapsulated first epoxy resin (microcapsules) mixed into the pressure sensitive adhesive polymer; and c) a first epoxy curative. In some embodiments, the first epoxy curative is blended into the pressure sensitive adhesive. In other embodiments, the first epoxy curative is the pressure sensitive adhesive polymer. In some embodiments, the first epoxy curative may be an adduct of a second epoxy curative and a second epoxy resin in a ratio of at least 2:1 second epoxy curative to second epoxy resin. The particles of encapsulated first epoxy resin comprise a core of first epoxy resin within a shell comprising an organic polymer, and optionally a layer of oil-in-water Pickering emulsifier particles borne on a surface of the shells. Typically, the tape may be cured to form a structural bond between adherends.

Abstract: Particles of encapsulated first epoxy resin (microcapsules) comprise: a) a core of first epoxy resin, within b) a shell comprising an organic polymer, and c) a layer of oil-in-water Pickering emulsifier particles borne on an outer surface of the shell. These particles may be used in liquid adhesive compositions, solid adhesive compositions such as tapes, or in other applications. In various embodiments, the oil-in-water Pickering emulsifier particles comprise materials selected from the group consisting of silica, fumed silica, calcium carbonate, barium sulfate, clay, carbon black, iron oxide, carbon nanotubes, latex, block copolymer micelles, polystyrene, poly(methyl methacrylate), any of the preceding materials which additionally are surface-modified, and combinations thereof. Particles of encapsulated epoxy resin may have an average diameter of 0.1-1000 micrometers, or in some embodiments 30-300 micrometers.