Patents by Inventor Catherine Ivers

Catherine Ivers has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method of electrolytic removal of metals from a wafer surface
    Patent number: 7993498
    Abstract: An apparatus and method designed to remove metals from a wafer surface using an electrolytic removal process. The apparatus includes a conductive pad having a plurality of alternating cathodes and anodes provided with a power source. The conductive pad is structured and configured to contact all metal islands on a surface of the wafer. Gaps are provided between pairs of the plurality of alternating cathodes and anodes.
    Type: Grant
    Filed: August 7, 2007
    Date of Patent: August 9, 2011
    Assignee: International Business Machines Corporation
    Inventors: Hariklia Deligianni, Laertis Economikos, Catherine Ivers, Xiaoyan Shao
  • APPARATUS AND METHOD OF ELECTROLYTIC REMOVAL OF METALS FROM A WAFER SURFACE
    Publication number: 20090038960
    Abstract: An apparatus and method designed to remove metals from a wafer surface using an electrolytic removal process. The apparatus includes a conductive pad having a plurality of alternating cathodes and anodes provided with a power source. The conductive pad is structured and configured to contact all metal islands on a surface of the wafer. Gaps are provided between pairs of the plurality of alternating cathodes and anodes.
    Type: Application
    Filed: August 7, 2007
    Publication date: February 12, 2009
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Hariklia Deligianni, Laertis Economikos, Catherine Ivers, Xiaoyan Shao
  • Solid CO2 cleaning
    Patent number: 6875286
    Abstract: A method and apparatus are provided for removing solid and/or liquid residues from electronic components such as semiconductor wafers utilizing liquid or supercritical carbon dioxide which is solidified on the surface of the wafer and then vaporized and removed from the system. In a preferred embodiment the solidification and vaporizing steps are repeated (cycled) before removal of the CO2 from the vessel. The residues are carried away with the vaporized carbon dioxide.
    Type: Grant
    Filed: December 16, 2002
    Date of Patent: April 5, 2005
    Assignee: International Business Machines Corporation
    Inventors: John M. Cotte, Catherine Ivers, Kenneth J. McCullough, Wayne M. Moreau, Robert J. Purtell, John P. Simons, William A. Syverson, Charles J. Taft
  • Solid CO2 cleaning
    Publication number: 20040112406
    Abstract: A method and apparatus are provided for removing solid and/or liquid residues from electronic components such as semiconductor wafers utilizing liquid or supercritical carbon dioxide which is solidified on the surface of the wafer and then vaporized and removed from the system. In a preferred embodiment the solidification and vaporizing steps are repeated (cycled) before removal of the CO2 from the vessel. The residues are carried away with the vaporized carbon dioxide.
    Type: Application
    Filed: December 16, 2002
    Publication date: June 17, 2004
    Applicant: International Business Machines Corporation
    Inventors: John M. Cotte, Catherine Ivers, Kenneth J. McCullough, Wayne M. Moreau, Robert J. Purtell, John P. Simons, William A. Syverson, Charles J. Taft