Abstract: The field of the invention is that of the discharge of heat from electronic cards in operation and more specifically from electronic devices comprising at least one heat pipe. The electronic package according to the invention comprises at least a mechanical structure comprising at least one housing, an electronic card, and means for mechanically attaching the electronic card in the housing of the structure, the electronic card comprising at least one electronic component and a device of high thermal conductivity joined to the electronic card and comprising two ends, the first end being in thermal contact with the electronic component and the second end of the device of high thermal conductivity being mechanically arranged so as to ensure good thermal contact with the walls of the housing of the structure.

Abstract: The field of the invention is that of electronic computers that have to operate in a harsh mechanical environment. One of the main fields of application relates to computers for on-board fixed-wing and rotary-wing aircraft avionics systems operating in a highly vibratory environment. These computers generally comprise one or more large electronic cards. To limit the effects of vibrations on the integrity of the electronic components and on the connection system for the card, the invention proposes to place on each face braced structures for reducing the mechanical effects of the vibrations or for shifting the resonant frequencies of the electronic cards so as to avoid high-Q effects.

Abstract: The field of the invention is that of electronic computers that have to operate in a harsh mechanical environment. One of the main fields of application relates to computers for on-board fixed-wing and rotary-wing aircraft avionics systems operating in a highly vibratory environment. These computers generally comprise one or more large electronic cards. To limit the effects of vibrations on the integrity of the electronic components and on the connection system for the card, the invention proposes to place on each face braced structures for reducing the mechanical effects of the vibrations or for shifting the resonant frequencies of the electronic cards so as to avoid high-Q effects.