Patents by Inventor Catherine M. B. Santini

Catherine M. B. Santini has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Compression and cold weld sealing method for an electrical via connection
    Patent number: 9796583
    Abstract: Compression cold welding methods, joint structures, and hermetically sealed containment devices are provided. The method includes providing a first substrate having at least one first joint structure which comprises a first joining surface, which surface comprises a first metal; providing a second substrate having at least one second joint structure which comprises a second joining surface, which surface comprises a second metal; and compressing together the at least one first joint structure and the at least one second joint structure to locally deform and shear the joining surfaces at one or more interfaces in an amount effective to form a metal-to-metal bond between the first metal and second metal of the joining surfaces. Overlaps at the joining surfaces are effective to displace surface contaminants and facilitate intimate contact between the joining surfaces without heat input. Hermetically sealed devices can contain drug formulations, biosensors, or MEMS devices.
    Type: Grant
    Filed: June 4, 2012
    Date of Patent: October 24, 2017
    Assignee: Microchips Biotech, Inc.
    Inventors: Jonathan R. Coppeta, Kurt Shelton, Norman F. Sheppard, Jr., Douglas Snell, Catherine M. B. Santini
  • COMPRESSION AND COLD WELD SEALING METHODS AND DEVICES
    Publication number: 20120241216
    Abstract: Compression cold welding methods, joint structures, and hermetically sealed containment devices are provided. The method includes providing a first substrate having at least one first joint structure which comprises a first joining surface, which surface comprises a first metal; providing a second substrate having at least one second joint structure which comprises a second joining surface, which surface comprises a second metal; and compressing together the at least one first joint structure and the at least one second joint structure to locally deform and shear the joining surfaces at one or more interfaces in an amount effective to form a metal-to-metal bond between the first metal and second metal of the joining surfaces. Overlaps at the joining surfaces are effective to displace surface contaminants and facilitate intimate contact between the joining surfaces without heat input. Hermetically sealed devices can contain drug formulations, biosensors, or MEMS devices.
    Type: Application
    Filed: June 4, 2012
    Publication date: September 27, 2012
    Applicant: MicroCHIPS, Inc.
    Inventors: Jonathan R. Coppeta, Kurt Shelton, Norman F. Sheppard, JR., Douglas Snell, Catherine M.B. Santini
  • Hermetically sealing using a cold welded tongue and groove structure
    Patent number: 8191756
    Abstract: Compression cold welding methods, joint structures, and hermetically sealed containment devices are provided. The method includes providing a first substrate having at least one first joint structure which comprises a first joining surface, which surface comprises a first metal; providing a second substrate having at least one second joint structure which comprises a second joining surface, which surface comprises a second metal; and compressing together the at least one first joint structure and the at least one second joint structure to locally deform and shear the joining surfaces at one or more interfaces in an amount effective to form a metal-to-metal bond between the first metal and second metal of the joining surfaces. Overlaps at the joining surfaces are effective to displace surface contaminants and facilitate intimate contact between the joining surfaces without heat input. Hermetically sealed devices can contain drug formulations, biosensors, or MEMS devices.
    Type: Grant
    Filed: November 4, 2005
    Date of Patent: June 5, 2012
    Assignee: MicroCHIPS, Inc.
    Inventors: Jonathan R. Coppeta, Kurt Shelton, Norman F. Sheppard, Jr., Douglas Snell, Catherine M. B. Santini