Patents by Inventor Ce Lv

Ce Lv has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250109495
    Abstract: A furnace tube for thin film deposition, includes: a process tube; a wafer boat, arranged inside the process tube and provided with multi-layered supporting members along the length direction of the process tube; a gas supply tube, arranged inside the process tube and provided with multi-layered gas supply holes along the length direction of the process tube. Multi-layered exhaust holes are arranged on the sidewall of the process tube along the length direction, wherein the distribution area of the gas supply holes is gradually reduced from top to bottom along the length direction of the sidewall of the process tube, and the distribution area of the exhaust holes is gradually reduced from top to bottom along the length direction of the sidewall of the process tube.
    Type: Application
    Filed: November 24, 2022
    Publication date: April 3, 2025
    Applicants: ACM RESEARCH (SHANGHAI), INC., ACM Research (Lingang), Inc., ACM Research Korea CO., LTD., CleanChip Technologies Limited
    Inventors: Hui Wang, Shan Zhang, Dongcheng Zhou, Hui Shen, Ce Lv, Daniel Park, John Kim, Dahai Zhang, Xiaoyan Zhang, Jun Wang, Shena Jia, Jian Wang
  • Publication number: 20250029848
    Abstract: A high-temperature tube furnace comprises: a process tube (1) with a top cover (101) arranged on the top end thereof, the top cover (101) being provided with through holes (1011); a gas supply pipe (2) communicating with the through holes (1011) of the top cover (101) of the process tube (1), process gas being introduced into the process tube (1) through the gas supply pipe (2) and the through holes (1011) of the top cover (101) of the process tube (1); a wafer boat (3) arranged in the process tube (1), and comprising a supporting frame (301) and supporting plates (302), the supporting plates (302) being distributed in multiple layers along the length direction of the supporting frame (301) and used for supporting multiple substrates (w), each substrate (w) being placed on one supporting plate and each supporting plate supporting the entire bottom of the substrate (w).
    Type: Application
    Filed: December 2, 2021
    Publication date: January 23, 2025
    Applicants: ACM RESEARCH (SHANGHAI), INC., ACM Research (Lingang), Inc., ACM Research Korea CO., LTD., CleanChip Technologies Limited
    Inventors: Hui Wang, Shan Zhang, Hui Shen, Ce Lv, Dongcheng Zhou, John Kim, Jae Sung Park, Jian Wang, Jun Wang, Shena Jia, Xiaoyan Zhang, Yy Kim