Patents by Inventor Cecil Archibald

Cecil Archibald has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of ablating an opening in a hard, non-metallic substrate
    Patent number: 6864460
    Abstract: A method of ablating a hole into a hard, non-metallic substrate is disclosed. At least on laser assembly capable of generating a laser beam in an axis having a focus that is moveable relative to said axis is provided. A focus of the laser beam is positioned adjacent at least one surface of the substrate. A first layer of the substrate is ablated by the laser beam. The focus is moved relative to the axis corresponding to the depth of the substrate thereby enabling ablation of successive layers of the substrate. Successive layers of the substrate are ablated to generate a hole into the substrate.
    Type: Grant
    Filed: July 2, 2002
    Date of Patent: March 8, 2005
    Assignee: Virtek Laser Systems, Inc.
    Inventors: Michael Cummings, Glover Ruiz, Cecil Archibald
  • Method of ablating an opening in a hard, non-metallic substrate
    Publication number: 20030006220
    Abstract: A method of ablating a hole into a hard, non-metallic substrate is disclosed. At least on laser assembly capable of generating a laser beam in an axis having a focus that is moveable relative to said axis is provided. A focus of the laser beam is positioned adjacent at least one surface of the substrate. A first layer of the substrate is ablated by the laser beam. The focus is moved relative to the axis corresponding to the depth of the substrate thereby enabling ablation of successive layers of the substrate. Successive layers of the substrate are ablated to generate a hole into the substrate.
    Type: Application
    Filed: July 2, 2002
    Publication date: January 9, 2003
    Inventors: Michael Cummings, Glover Ruiz, Cecil Archibald