Abstract: The invention relates to a sintered metal material comprising at least one magnetic part, characterised by directional through-pores having a size of between 1 and 100 ?m, said material having a density varying by less than 20% from one sample of 1 cm3 to another taken from a one-piece part made from the material.

Abstract: The invention relates to a sintered metal material comprising at least one magnetic part, characterised by directional through-pores having a size of between 1 and 100 ?m, said material having a density varying by less than 20% from one sample of 1 cm3 to another taken from a one-piece part made from the material.

Abstract: A method of electrical connection between a series of hard conductive points and corresponding pads arranged on a one face of a first component, and a series of buried ductile conductive bumps and corresponding pads arranged on one face of a second component. The method comprises forming said series of hard conductive points on said face of the first component; forming said series of buried ductile conducting bumps on said face of the second component; inserting said series of hard conductive points in said series of buried ductile conducting bumps at an ambient temperature; and directly sealing the first and second components together.

Abstract: The invention concerns a nanoprinted device comprising point shaped metallic patterns, in which each metallic pattern has a bilayer structure controlled in hardness and in chemical properties comprising a lower layer (30) constituting the base of the point and an upper layer (31) constituting the point itself.

Abstract: A component and process for making an electrical connection between a first component comprising a set of first pads and a set of hard conducting tips on one face, and a second component comprising a set of second pads and a set of ductile conducting bumps on the other face, in which the two faces are made to face each other and they are brought towards each other such that the tips can penetrate into these bumps, in which the space between two tips is less than the width of a bump and less than the width of a first pad. The process is applicable to such a component on which the set of conducting tips are installed.

Abstract: The invention concerns a method of electrical connection between a first component (10) comprising, on one face, a series of first pads (8) and a series of hard conductive points (13) and a second component (11) comprising, on one face, a series of second pads (9) and a series of ductile conductive bumps (14), in which one places opposite each other the two faces and one brings them together in such a way that the points (13) can penetrate into said bumps (14), in which the bumps are buried. The invention further concerns a component equipped with a series of buried ductile conductive bumps.

Abstract: This invention relates to a process for making an electrical connection between a first component (10) comprising a set of first pads (8) and a set of hard conducting tips (13) on one face, and a second component (11) comprising a set of second pads (9) and a set of ductile conducting bumps (14) on the other face, in which the two faces are made to face each other and they are brought towards each other such that the tips (13) can penetrate into these bumps (14), in which the space between two tips (13) is less than the width of a bump (14) and less than the width of a first pad (8). The invention also relates to such a component on which such a set of conducting tips is installed.

Abstract: The invention concerns a nanoprinted device comprising point shaped metallic patterns, in which. each metallic pattern has a bilayer structure controlled in hardness and in chemical properties comprising a lower layer (30) constituting the base of the point and an upper layer (31) constituting the point itself.