Abstract: A method for laser marking a substrate provided with a laser sensitive area using a laser, wherein the laser sensitive area is adapted to be activated at a threshold energy level, the method comprising: energizing the laser sensitive area by an energizing element irradiating the complete laser sensitive area, and exposing a portion of the laser sensitive area to irradiation from the laser, wherein the energizing element is configured to emit radiation being concentrated at a specific wavelength, and wherein the combined irradiation results in an energy passing the threshold energy level such that the laser sensitive area is activated at the portion where combined irradiation has occurred. The invention is also related to a laser marking system for carrying out the method.