Patents by Inventor Cedar Decker

Cedar Decker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240090917
    Abstract: A thrombectomy or atherectomy device (10) includes a thrombectomy or atherectomy catheter (12) including a cutter (20), and a physical barrier (22, 24) disposed proximate to the cutter. In some examples, the physical barrier (22, 24) can have a stiffness effective for the physical barrier to deflect a blood vessel having a thickness less than a first predetermined thickness threshold and effective for a thrombus or atheroma on an inner wall of the blood vessel to deflect the physical barrier.
    Type: Application
    Filed: December 14, 2021
    Publication date: March 21, 2024
    Inventor: Cedar DECKER
  • Publication number: 20240091035
    Abstract: A stent (10) includes a hollow tube (12) including interlaced metal strands (14); and a reinforcement providing radial strength reinforcement at an end (16, 18) of the hollow tube. In some examples, the reinforcement includes a first reinforcement at a first end (16) of the hollow tube (12); and a second reinforcement at a second end (18) of the hollow tube opposite the first end of the hollow tube.
    Type: Application
    Filed: December 14, 2021
    Publication date: March 21, 2024
    Inventors: Scott Robert WILSON, Cedar DECKER, Jake MERTENS
  • Publication number: 20240041625
    Abstract: A stent delivery system (100) includes a first outer sheath (111) configured to surround a first stent (110); and a second outer sheath (121) configured to surround a second stent (120).
    Type: Application
    Filed: December 13, 2021
    Publication date: February 8, 2024
    Inventors: Andrew Scherer, Scott Robert Wilson, Cedar Decker, Jake Mertens
  • Publication number: 20240009013
    Abstract: Systems and methods for deployment of a compressed expandable structure in a vessel lumen by inserting a catheter configured at a proximal end with dual shuttles; rotating a main drive shaft coupled via a set of drive gears to a set of catheter gears, enabling by rotation of the main drive shaft translated movement back and forth of the set of catheter gears wherein the set of catheter gears includes a pair of catheter gears each threaded in opposite directions for bidirectional movement to advance the inner lumen shuttle and the outer sheath shuttle in opposite directions; and deploying, by the bidirectional movement of the catheter gears, by the simultaneous withdrawal and insertion of the shuttle's outer sheath and inner lumen, the compressed expandable structure at a deployment location nearer to the catheter's distal end for more accurate placement to the treatment area's location.
    Type: Application
    Filed: September 14, 2021
    Publication date: January 11, 2024
    Inventor: Cedar DECKER
  • Publication number: 20230016928
    Abstract: The present disclosure relates generally to the use of medical devices for the treatment of chronic venous disease and collagenous scar tissue. In particular, the present disclosure provides methods and systems for remodeling a collagen obstruction using energy and an expandable catheter.
    Type: Application
    Filed: December 16, 2020
    Publication date: January 19, 2023
    Inventors: David ROLF, Cedar DECKER, Adam TSCHIDA
  • Patent number: 7875804
    Abstract: A method for forming an electrical interconnect on an integrated lead suspension or suspension component of the type having a stainless steel layer, a conductive lead layer and an insulator layer separating the stainless steel and conductive lead layers. An aperture is formed through only the insulator layer to expose the stainless steel layer at an interconnect site. An interconnect mask is applied around the interconnect site. A first conductive material is electroplated onto the stainless steel layer at the interconnect site to form a plated interconnect between the spring metal layer and the conductive lead layer. The mask is then removed. An electrical interconnect between the stainless steel and conductive lead layers including an aperture only through the insulator layer and an electroplated conductive material interconnect extending between both the spring metal layer and the conductive lead layer.
    Type: Grant
    Filed: September 27, 2006
    Date of Patent: January 25, 2011
    Assignee: Hutchinson Technology Incorporated
    Inventors: Jeffrey M. Tronnes, Cedar Decker, Brett L. Haugen