Patents by Inventor Cedric Le Coq

Cedric Le Coq has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140035132
    Abstract: A surface mount chip including, on the side of a surface, first and second pads of connection to an external device, wherein, in top view, the first pad has an elongated general shape, and the second pad is a point-shaped pad which is not aligned with the first pad.
    Type: Application
    Filed: July 31, 2013
    Publication date: February 6, 2014
    Applicants: Universite Francois Rabelais, STMicroelectronics (Tours) SAS
    Inventors: Olivier Ory, Cedric Le Coq