Abstract: A mass spectrometer comprising: a vacuum housing comprising a first vacuum chamber having a first gas exhaust port; a gas pump (1700) having a first gas inlet port connected to the first gas exhaust port (H1) by a first gas conduit for evacuating the first vacuum chamber, and a first apertured cover (2010) arranged over the first gas exhaust port (H1) or first gas inlet port, or in the first gas conduit therebetween.

Abstract: A system may include a memory device to store instructions and data, and at least one processing device to execute the instructions stored in the memory device to: receive a background image and a digital object to be composited onto the background image in a mixed reality view, generate a 2D bounding region for the digital object, select a version of the background image at a pre-defined resolution, overlay the 2D bounding region on the selected version of the background image and obtain a set of samples of the colors of pixels of the selected version along a perimeter of the 2D bounding region, and determine a value for one or more digital lighting sources to illuminate the digital object in the mixed reality view, based, at least in part, on the set of samples.

Abstract: A system may include a memory device to store instructions and data, and at least one processing device to execute the instructions stored in the memory device to: receive a background image and a digital object to be composited onto the background image in a mixed reality view, generate a 2D bounding region for the digital object, select a version of the background image at a pre-defined resolution, overlay the 2D bounding region on the selected version of the background image and obtain a set of samples of the colors of pixels of the selected version along a perimeter of the 2D bounding region, and determine a value for one or more digital lighting sources to illuminate the digital object in the mixed reality view, based, at least in part, on the set of samples.

Abstract: A system may include a memory device to store instructions and data, and at least one processing device to execute the instructions stored in the memory device to: receive a background image and a digital object to be composited onto the background image in a mixed reality view, generate a 2D bounding region for the digital object, select a version of the background image at a pre-defined resolution, overlay the 2D bounding region on the selected version of the background image and obtain a set of samples of the colors of pixels of the selected version along a perimeter of the 2D bounding region, and determine a value for one or more digital lighting sources to illuminate the digital object in the mixed reality view, based, at least in part, on the set of samples.

Abstract: A method for fabricating an image sensor includes following steps. First, a substrate having semiconductor devices formed thereon is provided. Interlayer insulating films and Interlayer conductive films are formed on the substrate alternately, wherein the interlayer conductive films are electrically connected to the semiconductor devices. Next, isolated photo-diodes are formed on a topmost layer of the interlayer conductive films, wherein one electrode of the isolated photo-diodes is electrically connected to a topmost layer of the interlayer conductive films. A top insulating layer is formed on the topmost layer of the interlayer conductive films, wherein the isolated photo-diodes are covered by the top insulating layer. A top conductive layer is formed in the top insulating layer, wherein the top conductive layer is electrically connected to another electrode of the isolated photo-diodes.

Abstract: A method for fabricating an image sensor includes following steps. First, a substrate having semiconductor devices formed thereon is provided. Interlayer insulating films and Interlayer conductive films are formed on the substrate alternately, wherein the interlayer conductive films are electrically connected to the semiconductor devices. Next, isolated photo-diodes are formed on a topmost layer of the interlayer conductive films, wherein one electrode of the isolated photo-diodes is electrically connected to a topmost layer of the interlayer conductive films. A top insulating layer is formed on the topmost layer of the interlayer conductive films, wherein the isolated photo-diodes are covered by the top insulating layer. A top conductive layer is formed in the top insulating layer, wherein the top conductive layer is electrically connected to another electrode of the isolated photo-diodes.

Abstract: An image sensor including a substrate having a plurality of semiconductor devices formed thereon, an interconnection layer disposed on the substrate, and a plurality of isolated photo-diodes embedded in the interconnection layer is provided. The isolated photo-diodes are located above the semiconductor devices and electrically connected to the semiconductor devices through the interconnection layer. In the above-mentioned image sensor, thickness of the interconnection layer is not limited so as to facilitate fabrication of the SOC CMOS image sensor. In addition, the image sensor is advantageous in relatively high fill-factor, layout area saving and easy being implanted. Furthermore, a method for fabricating the image mentioned above is also provided.

Abstract: An image sensor including a substrate having a plurality of semiconductor devices formed thereon, an interconnection layer disposed on the substrate, and a plurality of isolated photo-diodes embedded in the interconnection layer is provided. The isolated photo-diodes are located above the semiconductor devices and electrically connected to the semiconductor devices through the interconnection layer. In the above-mentioned image sensor, thickness of the interconnection layer is not limited so as to facilitate fabrication of the SOC CMOS image sensor. In addition, the image sensor is advantageous in relatively high fill-factor, layout area saving and easy being implanted. Furthermore, a method for fabricating the image mentioned above is also provided.

Abstract: A gap-filling process is provided. A substrate having a dielectric layer thereon is provided. The dielectric layer has an opening therein. A gap-filling material layer is formed over the dielectric layer and inside the opening. A portion of the gap-filling material is removed from the gap-filling material layer to expose the dielectric layer. A gap-filling material treatment of the surface of the gap-filling material layer and the dielectric layer is carried out to planarize the gap-filling material layer so that a subsequently formed bottom anti-reflection coating or material layer over the gap-filling material layer can have a high degree of planarity.

Abstract: A gap-filling process is provided. A substrate having a dielectric layer thereon is provided. The dielectric layer has an opening therein. A gap-filling material layer is formed over the dielectric layer and inside the opening. A portion of the gap-filling material is removed from the gap-filling material layer to expose the dielectric layer. A gap-filling material treatment of the surface of the gap-filling material layer and the dielectric layer is carried out to planarize the gap-filling material layer so that a subsequently formed bottom anti-reflection coating or material layer over the gap-filling material layer can have a high degree of planarity.

Abstract: An aqueous water-dilutable composition for use as a cathodic coating material is prepared by partially epoxidizing a liquid polydiene, all or a major proportion of which is derived from a 1,4-conjugated diene, such as butediene, aminating the epoxidized polydiene at a temperature of at least 120.degree. C. and, optionally in the presence of an organic hydroxy-group-containing catalyst, with at least polyamine reactant which contains not more than one primary amino group and/or at least one secondary amine group with the or any remaining amine group(s) being selected from secondary and tertiary amine groups and thereafter partially neutralizing the aminated polymeric material with acid to yield a water-dilutable material containing residual unsaturation.

Abstract: A pressure-sensitive adhesive composition with a low content of volatile liquids, such as organic solvents or water, comprises a maleinized liquid polybutadiene blended with one or more tackifying resins and one or more curing agents, suchas a blocked polyamine, the composition containing less than 20% by weight of volatile liquids. The liquid polybutadiene, which can be made by any conventional polymerization mechanism, is maleinized by reaction with meleic anhydride, and it is convenient to add the tackifying resin and any other ingredients of the composition to the maleinized liquid polybutadiene just after the maleinization reaction.