Patents by Inventor Celia H. Ketley

Celia H. Ketley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low temperature single step curing polyimide adhesive
    Patent number: 4740830
    Abstract: Disclosed is a silver-filled paste, an electronic assembly comprising a semiconductive device attached to a substrate by said silver-filled paste, and a method of bonding an electronic device to a substrate using said silver-filled paste. The silver-filled paste comprises a silver powder; a resin having the formula: ##STR1## wherein R comprises a divalent linking group; and a solvent for the resin which comprises one or more electron donor groups.
    Type: Grant
    Filed: August 19, 1987
    Date of Patent: April 26, 1988
    Assignee: W. R. Grace & Co.
    Inventor: Celia H. Ketley
  • Low temperature single step curing polyimide adhesive
    Patent number: 4714726
    Abstract: Disclosed is a silver-filled paste, an electronic assembly comprising a semiconductive device attached to a substrate by said silver-filled paste, and a method of bonding an electronic device to a substrate using said silver-filled paste. The silver-filled paste comprises a silver powder; a resin having the formula: ##STR1## wherein R comprises a divalent linking group; and a solvent for the resin which comprises one or more electron donor groups.
    Type: Grant
    Filed: June 4, 1986
    Date of Patent: December 22, 1987
    Assignee: W. R. Grace & Co.
    Inventor: Celia H. Ketley