Patents by Inventor Celso SOUZA

Celso SOUZA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Measurement of current within a conductor
    Patent number: 11022630
    Abstract: In the field of Rogowski coils for the measurement of current within a conductor there is provided an electrical interface for connection to a Rogowski coil arranged around a primary conductor. The electrical interface includes an input that is configured to sample an input voltage signal from the Rogowski coil. The electrical interface also has an integrator circuit which includes an integrator module that is configured to integrate the sampled input voltage signal to provide an output voltage signal from which can be derived a primary current flowing through the primary conductor. The integrator module employs a transfer function that includes an attenuation factor.
    Type: Grant
    Filed: September 14, 2017
    Date of Patent: June 1, 2021
    Assignee: General Electric Technology GmbH
    Inventors: Hengxu Ha, Celso Souza, Davi Bernardi, Xianwu Zeng, Elias Bencz
  • IMPROVEMENTS IN OR RELATING TO THE MEASUREMENT OF CURRENT WITHIN A CONDUCTOR
    Publication number: 20190187186
    Abstract: In the field of Rogowski coils for the measurement of current within a conductor there is provided an electrical interface for connection to a Rogowski coil arranged around a primary conductor. The electrical interface includes an input that is configured to sample an input voltage signal from the Rogowski coil. The electrical interface also has an integrator circuit which includes an integrator module that is configured to integrate the sampled input voltage signal to provide an output voltage signal from which can be derived a primary current flowing through the primary conductor. The integrator module employs a transfer function that includes an attenuation factor.
    Type: Application
    Filed: September 14, 2017
    Publication date: June 20, 2019
    Inventors: Hengxu HA, Celso SOUZA, Davi BERNARDI, Xianwu ZENG, Elias BENCZ