Patents by Inventor Cesar Avitia

Cesar Avitia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7263870
    Abstract: The instrument panel gauge assembly includes an applique having gauge graphics printed thereon and a needle pointer for a gauge assembly positioned adjacent thereto. A transparent chaplet is formed within the applique to allow light to pass through. The needle passes over the chaplet as the needle moves. When the needle is positioned directly in front of the chaplet, light is blocked from passing through the chaplet. A light sensing element is positioned behind the applique to detect the presence of light passing through the chaplet. A light baffle guides light passing through the chaplet to the light sensing element. A controller receives a signal from the light sensing element indicating when the needle pointer is directly in front of the chaplet. The controller then compares the actual input to the gauge with the position of the needle pointer, calculates a correction factor, and calibrates the gauge accordingly.
    Type: Grant
    Filed: August 24, 2005
    Date of Patent: September 4, 2007
    Assignee: Visteon Global Technologies, Inc.
    Inventors: Cesar Avitia, Martin Joel Ibarra, Raul Antonio Rascon
  • Publication number: 20070184688
    Abstract: A circuit board including a conductive device and method for Interconnecting the first and second sides of a printed circuit board. The device includes first and second interconnection portions and an elongated member. The first Interconnection portion contacts a surface of the first side of the printed circuit board and the second Interconnection portion contacts the second side of the printed circuit board. The elongated member has first and second ends. The first end of the elongated member is connected to the first Interconnection portion and the second end of elongated member is connected to the second interconnection portion.
    Type: Application
    Filed: February 8, 2006
    Publication date: August 9, 2007
    Inventors: Cesar Avitia, Francisco Ceniceros S., Martin Ibarra
  • Publication number: 20070044535
    Abstract: The instrument panel gauge assembly includes an applique having gauge graphics printed thereon and a needle pointer for a gauge assembly positioned adjacent thereto. A transparent chaplet is formed within the applique to allow light to pass through. The needle passes over the chaplet as the needle moves. When the needle is positioned directly in front of the chaplet, light is blocked from passing through the chaplet. A light sensing element is positioned behind the applique to detect the presence of light passing through the chaplet. A light baffle guides light passing through the chaplet to the light sensing element. A controller receives a signal from the light sensing element indicating when the needle pointer is directly in front of the chaplet. The controller then compares the actual input to the gauge with the position of the needle pointer, calculates a correction factor, and calibrates the gauge accordingly.
    Type: Application
    Filed: August 24, 2005
    Publication date: March 1, 2007
    Inventors: Cesar Avitia, Martin Ibarra, Raul Rascon
  • Patent number: 6496384
    Abstract: A circuit board assembly and method of fabricating an assembly are provided. The assembly preferably comprises a first circuit board defining an aperture and a second circuit board having an edge. The first circuit board has at least one conductive feature proximate the aperture, and the second circuit board has at least one conductive feature proximate the edge. Each board has at least one circuit trace in electrical communication with its respective conductive feature. The conductive features of the boards are placed in electrical communication with each other by way of the edge of the second board being disposed in the aperture of the first board. A solder joint can be disposed on the assembly so as to connect the first and second boards.
    Type: Grant
    Filed: September 21, 2001
    Date of Patent: December 17, 2002
    Assignee: Visteon Global Technologies, Inc.
    Inventors: Jorge Morales, Cesar Avitia