Abstract: Disclosed is side liner for a centrifugal pump. The side liner comprises an aperture for access to a central chamber of the centrifugal pump through the side liner. The side liner also comprises a plurality of grooves on a surface contacting material pumped by the centrifugal pump, the plurality of grooves extending radially from an inner edge of the surface, located near the aperture, to an outer edge.

Abstract: The present invention relates to a pump apparatus for reducing the size of suspended solids in a fluid prior to pumping the fluid through a pump, comprising: a processing chamber having an inner side wall, the inner side wall comprising one or more formations adapted to reduce the size of suspended solids in the fluid; an inlet to the processing chamber having a diameter D1 for receiving the fluid; an outlet from the processing chamber having a diameter D2 for conveying the fluid to the pump; and a central axis extending from a center of the inlet and a center of the outlet, wherein the one or more formations extend in a general direction from the inlet to the outlet, and wherein the processing chamber is frustoconical in shape and D1>D2.

Abstract: An assembly for reducing the size of suspended solids in a pump intake including a rotatable element and a screen configured to locate in a position between a pump and the rotatable element.

Abstract: An electrical connector assembly formed using an overmolding process. The electrical connector assembly includes a body which houses spring contacts, a spring mechanism, and terminals opposite to the spring contacts. The body is enclosed with a and protector which is defined by an upper portion and a lower portion. The upper and lower portions are cooperatively engaged to provide structural protection during the overmolding process and sealing protection as well.

Abstract: An enclosure for small power supplies for cellular telephones, laptop computers and the like is formed in two layers. The first layer is an inner box constructed of a pair of about 0.8 mm thick PBT shells that enclose and retain the electronics. The second layer is an overmolding of about 1.0 mm. thick PVC that surrounds the shells, seals them together, and forms a strain relief for a cable attached to the electronics. The two-layer construction allows considerable savings in material and assembly costs.