Abstract: Wire removal systems and methods for packaging applications. In some embodiments, a method of manufacturing a module can include providing a packaging substrate including a die mounted on the packaging substrate and a plurality of defective wires coupled to the packaging substrate. The method can include executing in response to a trigger, by an automated wire cutting apparatus without user input, a set of stored instructions to position a wire cutting instrument of the automated wire cutting apparatus and a first defective wire of the plurality of defective wires adjacent to one another, and sequentially detach the plurality of defective wires from the packaging substrate using the wire cutting instrument.

Abstract: Wire removal systems and methods for packaging applications. In some embodiments, a method of manufacturing a module can include receiving by an automated wire cutting apparatus a packaging substrate including a die mounted thereon and a defective wire coupled thereto, positioning one or both of a wire cutting instrument of the automated wire cutting apparatus and the packaging substrate relative to the other based on predetermined instructions, and detaching the defective wire from the packaging substrate using the wire cutting instrument.

Abstract: Wire removal systems and methods for packaging applications. In some embodiments, a method of manufacturing a module can include receiving by an automated wire cutting apparatus a packaging substrate including a die mounted thereon and a defective wire coupled thereto, positioning one or both of a wire cutting instrument of the automated wire cutting apparatus and the packaging substrate relative to the other based on predetermined instructions, and detaching the defective wire from the packaging substrate using the wire cutting instrument.