Abstract: A heat dissipation casing is adapted to be mounted to an electronic device, and includes a casing body, a support member and a plurality of thermally conductive fibers. The casing body has an inner surface facing the electronic device, and an outer surface opposite to the inner surface. The support member is connected to the inner surface of the casing body. The thermally conductive fibers are distributed in the support member.

Abstract: A method of making a heat dissipation element includes the steps of: preparing a liquid matrix having a viscosity ranging from 1000 cps to 30000 cps; dipping a plurality of thermally conductive fibers into the liquid matrix and having the thermally conductive fibers partially exposed from the liquid matrix; and solidifying the liquid matrix into a support member from which the thermally conductive fibers are partially exposed.