Abstract: A chemical solution coating apparatus, having a carrier board and a plurality of spray apparatuses. The carrier board is to carry the wafer to be coated, and the spray apparatuses are located at a periphery of the carrier board to evenly spray chemical solution on the wafer. Since the chemical solution is coated on the wafer in a spray manner, so that the unnecessary lapse and process cost are avoided. The number and spraying angle spray apparatuses can be adjusted to reach an optimum status.

Abstract: A photoresist dispensing system used in a photoresist coating machine includes a pump, a switch valve, a sucking-back valve, a solenoid valve, a first set of speed controllers a second set of speed controllers and a sucking-back speed controller. The pump is used to transport liquid photoresist to a wafer through the switch valve. The sucking-back valve is controlled by solenoid valve through the sucking-back speed controller to produce or release a sucking force on the liquid photoresist to prevent it from undesired dropping onto the wafer. The solenoid valve also controls the switch valve and the pump to start or stop photoresist dispensing. The first set of speed controllers is coupled between the switch valve and the solenoid valve and the second set of speed controller is coupled between the pump and the solenoid valve.